All-in-One RGB MicroLEDs
May 17, 2019 | CEA-LetiEstimated reading time: 1 minute
Leti, a research institute of CEA Tech, today announced a new technology for fabricating GaN microLED displays for applications ranging from smart watches to TVs with no size limit.
The approach fabricates elementary units of all-in-one red, green, blue (RGB) microLEDs on a CMOS driving circuit, and transfers the devices to a simple receiving substrate. The units are fabricated with a full semiconductor, wafer-scale approach.
“This new process, in the proof-of-concept stage, paves the way to commercial, high-performance microLED displays,” said François Templier, CEA-Leti’s strategic marketing manager for photonic devices. “The CMOS-based approach provides higher brightness and higher resolution microLEDs and is a game changer for very large TVs.”
While they promise exceptional image quality and better energy efficiency than existing liquid crystal display (LCD) and organic light-emitting diode (OLED) technologies, microLED displays currently face significant barriers on the road to commercialization.
One of the biggest challenges is improving the performance of the driving electronics, which require more power to deliver brighter images and more speed to support continuously increasing demands for high display resolution. Faster electronics are required to power millions of pixels in a fixed-frame time in microLED displays, but existing driving display technology, known as thin-film transistor (TFT) active matrix, cannot provide the necessary current and speed.
CEA-Leti’s new approach fabricates CMOS-driven, high-performance GaN microLED displays with a simplified transfer process that eliminates the use of the TFT backplane. RGB microLEDs are stacked directly onto a micro-CMOS circuit, and each unit is transferred onto a simple receiving substrate. Then, the RGB microLEDs and the backplane are fabricated on a single semiconductor line.
In addition to increasing power and driving speed – and improving display performance – this process avoids several costly steps needed with current technology to make electrical and mechanical contacts between microLEDs and the receiving substrates.
CEA-Leti presented a paper on the breakthrough titled “A New Approach for Fabricating High-Performance MicroLED Displays” on May 14, during Display Week 2019 in San Jose, California.
Suggested Items
Absolute EMS Champions Collaboration Between Humans and Robots in Modern Manufacturing
04/19/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, offers a perfect factory environment that seamlessly blends robotic automation with human expertise.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.