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Designing Electronics for High Thermal Loads

04/16/2024 | Akber Roy, Rush PCB Inc.
Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.

IPC Design Competition: On Your Mark, Get Set, Go!

04/10/2024 | Andy Shaughnessy, Design007 Magazine
I recently spoke with IPC’s Patrick Crawford, manager of design standards and related industry programs, and Kris Moyer, certified IPC master instructor, about this year’s IPC Design Competition. Now in its third year, the preliminary heat began in January, and the winners will compete in the final heat at IPC APEX EXPO in Anaheim.

Argonne Develops Plans to be Sure Nuclear Power Plants Stay Cool

04/05/2024 | BUSINESS WIRE
Climate scientists and nuclear science and engineering experts at the U.S. Department of Energy’s (DOE) Argonne National Laboratory are joining forces to develop a plan B for nuclear power in Richland, Washington.

Apollo Seiko Presents the Next Frontier in Non-Contact Soldering at 2024 IPC APEX EXPO

03/12/2024 | Apollo Seiko
Apollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to showcase its latest advancements at Booth 1408 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California.

Indium Corporation Experts to Present at SEMI THERM

03/07/2024 | Indium Corporation
Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.
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