2Q19 Silicon Wafer Area Shipments Fall 2.2% from Q1 Levels


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Worldwide silicon wafer area shipments totaled 2,983 million square inches in the second quarter of 2019, down 2.2% from the 3,051 million square inches shipped in the first quarter of the year and 5.6% lower than shipments during the same period in 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

"Global silicon wafer shipment are being impacted by the same headwinds that are facing the broader industry,” said Neil Weaver, chairman SEMI SMG and vice president, Product Development and Applications Engineering of Shin Etsu Handotai America. “While shipment area growth is currently subdued, the long-term outlook for the industry remains positive.”

Silicon Area Shipment Trends - Semiconductor applications only

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All data cited in this release includes polished silicon wafers, such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin, round disks are produced in various diameters—from one inch to 12 inches—and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

About SEMI

SEMI connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies.

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