Novel Process for Structuring Quantum Materials
August 1, 2019 | Forschungszentrum JülichEstimated reading time: 2 minutes
Implementing quantum materials in computer chips provides access to fundamentally new technologies. In order to build powerful and fault-resistant quantum computers, it is possible, for example, to combine topological insulators with superconductors. This process step brings with it some challenges that have now been solved by researchers from Jülich.
Image Caption: a) Scanning electron micrograph during the "Jülich process": A chip can be seen during fabrication. The topological insulator (dyed red) has already been selectively deposited. In a next fabrication step, the superconductor is applied via shadow mask deposition. In black-and-white, various mask systems are recognizable which make it possible to manufacture the desired components completely in ultrahigh vacuum. b) In such networks one wants to try to move so-called majorana modes (represented as stars) along the topological tracks in order to enable topologically protected quantum computing operations. While the blue and violet Majorana fashion stays in the same position (x, y) in the room. Credit: Forschungszentrum Jülich / Peter Schüffelgen
Even the ancient Inca used knots in cords to encode and store information in their ancient writing "Quipu". The advantage: unlike ink on a sheet of paper, the information stored in the knot is robust against external destructive influences, such as water. Even novel quantum computers should be able to store information robustly in the form of nodes. For this, however, no cord is knotted, but so-called quasi-particles in space and time.
What is needed to build such a quantum node machine are new materials called quantum materials. Experts speak of topological insulators and superconductors. The processing of these materials to components for quantum computers is a challenge in itself; especially because topological insulators are very sensitive to air.
Scientists in Jülich have now developed a novel process that makes it possible to structure quantum materials without exposing them to air during processing. The so-called "Jülich process" makes it possible to combine superconductors and topological insulators in ultrahigh vacuum to produce complex components.
Initial measurements in their samples indicate evidence of majorana states. "Majoranas" are exactly the promising quasiparticles to be knotted in the shown networks of topological insulators and superconductors to enable robust quantum computing. In a next step, the researchers of the Peter Grünberg Institute, together with their colleagues from Aachen, the Netherlands and China, will provide their networks with readout and control electronics in order to make the quantum materials available for the application.
Suggested Items
Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building
04/12/2024 | Newccess IndustrialOn a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry.
The Need for a Holistic Global Sustainability Standard
04/10/2024 | Michael Ford, Aegis SoftwareNo one can deny that the resources of our fragile planet are finite. The environment seems like a third party, subject to constant degradation. We’re acutely aware of the effects of pollution on our climate, and despite our “throw-away” culture, recycling and recovery of materials has remained relatively expensive, even as we use more energy just to survive.
iNEMI Publishes Four Roadmap Topics
04/04/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
Checking In With ICAPE Group
04/03/2024 | Nolan Johnson, I-Connect007ICAPE Group’s field application engineer Erik Pederson drills down on sustainability, supply chain resiliency, and what value engineering really looks like in this exclusive interview. Founded in 1999, European-based ICAPE Group provides 21 million printed circuit boards and over six million technical parts to manufacturers every month. With 30 PCB manufacturing partners globally and 50 partners providing a wide array of technical parts, ICAPE Group has operations in China, Taiwan, Thailand, South Korea, Vietnam, South Africa, Europe, Mexico, and the United States. The company also focuses on the value proposition for its customers.