Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

03/18/2024 | IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry. 

Omron to Showcase Inspection and Factory Automation Solutions at IPC APEX EXPO 2024

03/18/2024 | Omron
OMRON Automation Americas, a global leader in industrial automation solutions will be exhibiting at IPC APEX 2024, taking place at the Anaheim Convention Center from April 9th to April 11th.  Attendees are invited to visit Omron's booth #2647 to hear how AI powers Omron’s latest technology, in addition to learning more about our newest X-Ray inspection machine, the VT-X850. This new 3D CT X-Ray inspection system is designed specifically for electric vehicle (EV) surface mount technology (SMT) manufacturing lines.

LPKF Receives Major Customer Order in Solar

03/18/2024 | LPKF
The technology company LPKF Laser & Electronics SE has once again received a major order in the solar market, continuing its long-standing successful collabo[1]ration with a leading international manufacturer.

Northrop Grumman Honors Suppliers for Excellence

03/14/2024 | Northrop Grumman
Northrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas. 

Qualcomm Announces Shortlisted Teams for the Qualcomm Vietnam Innovation Challenge 2024

03/13/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced the shortlisted companies for the Qualcomm® Vietnam Innovation Challenge 2024 (QVIC) program.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in