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Enabling a New Paradigm for Flexible, Point of Need Design and Manufacturing

03/18/2024 | DARPA
The Department of Defense (DOD) needs the flexibility to manufacture critical structures at the time and point of need using locally available materials.

Indium Corporation Experts to Present Throughout IPC APEX EXPO

03/18/2024 | Indium Corporation
Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.​​​​​​​

Indium Corporation Celebrates 90 Years of Materials Science Innovation

03/13/2024 | Indium Corporation
Indium Corporation will commemorate its 90th anniversary on March 13. Indium Corporation’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.

DARPA Explores Additive Manufacturing’s Revolutionary Potential for Futuristic Microsystems

03/12/2024 | DARPA
DARPA played a seminal role in establishing materials science as a discipline. One of the latest disruptive efforts in new materials and applications, the Additive Manufacturing of Microelectronic systEms (AMME) program, seeks to launch microsystems manufacturing far beyond today’s state of the art.

Essemtec Exhibiting at IPC APEX Expo at Booth 2409

03/12/2024 | Essemtec
Essemtec presents its agile dispensing platform on the TARANTULA machine. The machine can be equipped with five different valves, for a comprehensive range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam, and Underfill.
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