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North America-based manufacturers of semiconductor equipment posted $2.00 billion in billings worldwide in August 2019 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4% lower than the final July 2019 level of $2.03 billion, and is 10.5% lower than the August 2018 billings level of $2.23 billion.
“August billings of North American equipment manufacturers declined one percent relative to July levels,” said Ajit Manocha, president and CEO of SEMI. “However, even though the industry is facing headwinds, monthly billings levels have remained above $2 billion for the past four months.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
SEMI connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies.