OpFires Program Advances Technology for Upper Stage, Achieves Preliminary Design Review


Reading time ( words)

DARPA’s Operational Fires (OpFires) program has reached a major program milestone, completing booster preliminary design review of an innovative two-stage tactical missile system. OpFires aims to develop and demonstrate a ground-launched hypersonic weapon system to engage critical, time-sensitive targets in contested environments.

“U.S. ground-based forces currently are limited in effective range of surface-to-surface precision fires. The goal for OpFires is to provide the combatant commander with options in force deployment, and allow persistent standoff from unpredictable land-launch positions,” said Maj. Amber Walker (U.S. Army), program manager for OpFires in the Tactical Technology Office. “The envisioned ‘tuneable’ propulsion system could offer mission flexibility for ground-to-ground tactical missiles.”

The first two phases of the program focus on the propulsion technologies required to deliver diverse payloads a variety of ranges. Since Phase 1 contract awards last fall, Aerojet Rocketdyne, Exquadrum, and Sierra Nevada Corporation (SNC) have made critical discoveries in advanced rocket motor technology for the OpFires upper stage, completing more than 30 motor trials from subscale through full size. These advances put the program on track for booster critical design review in late 2020.

Exquadrum completed a full-scale, full-duration test fire Sept. 19, which marked the performer’s culminating event for Phase 1. SNC has targeted October to complete its Phase 1 testing, and Aerojet Rocketdyne completed six subscale tests in August. Development activities will continue under Phase 2, which will culminate with multiple hot/static fires targeted for late 2020.

DARPA anticipates awards later this year for the third phase of the OpFires program, which aims to develop an operational system design leveraging propulsion systems concepts developed under the first two phases of the program. Phase 3 will conclude with integrated end-to-end flight tests to begin in 2022.

Share

Print


Suggested Items

Worldwide Semiconductor Equipment Billings at $13.3 Billion in 2Q19; Down 20%

09/12/2019 | SEMI
Worldwide semiconductor manufacturing equipment billings reached $13.3 billion in the second quarter of 2019, down 20% from the same quarter of 2018 and 3% from than the previous quarter.

Designing Chips for Real Time Machine Learning

04/01/2019 | DARPA
DARPA’s Real Time Machine Learning (RTML) program seeks to reduce the design costs associated with developing ASICs tailored for emerging ML applications by developing a means of automatically generating novel chip designs based on ML frameworks.

DARPA’s Drive to Keep the Microelectronics Revolution at Full Speed Builds Its Own Momentum

08/28/2017 | DARPA
To perpetuate the pace of innovation and progress in microelectronics technology over the past half-century, it will take an enormous village rife with innovators. This week, about 100 of those innovators throughout the broader technology ecosystem, including participants from the military, commercial, and academic sectors, gathered at DARPA headquarters at the kickoff meeting for the Agency’s new CHIPS program, known in long form as the Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program.



Copyright © 2019 I-Connect007. All rights reserved.