OpFires Program Advances Technology for Upper Stage, Achieves Preliminary Design Review
October 7, 2019 | DARPAEstimated reading time: 1 minute
DARPA’s Operational Fires (OpFires) program has reached a major program milestone, completing booster preliminary design review of an innovative two-stage tactical missile system. OpFires aims to develop and demonstrate a ground-launched hypersonic weapon system to engage critical, time-sensitive targets in contested environments.
“U.S. ground-based forces currently are limited in effective range of surface-to-surface precision fires. The goal for OpFires is to provide the combatant commander with options in force deployment, and allow persistent standoff from unpredictable land-launch positions,” said Maj. Amber Walker (U.S. Army), program manager for OpFires in the Tactical Technology Office. “The envisioned ‘tuneable’ propulsion system could offer mission flexibility for ground-to-ground tactical missiles.”
The first two phases of the program focus on the propulsion technologies required to deliver diverse payloads a variety of ranges. Since Phase 1 contract awards last fall, Aerojet Rocketdyne, Exquadrum, and Sierra Nevada Corporation (SNC) have made critical discoveries in advanced rocket motor technology for the OpFires upper stage, completing more than 30 motor trials from subscale through full size. These advances put the program on track for booster critical design review in late 2020.
Exquadrum completed a full-scale, full-duration test fire Sept. 19, which marked the performer’s culminating event for Phase 1. SNC has targeted October to complete its Phase 1 testing, and Aerojet Rocketdyne completed six subscale tests in August. Development activities will continue under Phase 2, which will culminate with multiple hot/static fires targeted for late 2020.
DARPA anticipates awards later this year for the third phase of the OpFires program, which aims to develop an operational system design leveraging propulsion systems concepts developed under the first two phases of the program. Phase 3 will conclude with integrated end-to-end flight tests to begin in 2022.
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.