Boeing Proposes ‘Fewest Steps to the Moon’ for NASA’s Human Lander
November 5, 2019 | BoeingEstimated reading time: 2 minutes
Boeing today submitted a proposal to NASA for an integrated Human Lander System (HLS) designed to safely take astronauts to the surface of the moon and return them to lunar orbit as part of the Artemis space exploration program.
The company’s proposal calls for delivering the lander’s Ascent Element and Descent Element to lunar orbit in one rocket launch to ensure it is tailored for maximum capability and crew safety. This approach reduces the complexity and risk of sending multiple segments to orbit on multiple launches, enabling a crewed lunar surface landing with only five mission critical events instead of the 11 or more required by alternate strategies. Boeing’s integrated lander also can carry itself from lunar orbit to the surface without an additional transfer stage or “space tug,” further reducing launches and simplifying the steps to a successful landing.
“Using the lift capability of NASA’s Space Launch System (SLS) Block 1B, we have developed a ‘Fewest Steps to the Moon’ approach that minimizes mission complexity, while offering the safest and most direct path to the lunar surface,” said Jim Chilton, senior vice president of Space and Launch for Boeing Defense, Space & Security.
Boeing’s design relies on NASA’s exploration backbone, the SLS rocket currently in production at NASA’s Michoud Assembly Facility (MAF). The SLS has an unmatched lift capability that builds on proven flight components. This approach shortens development time and lowers risk, enabling NASA to safely land on the moon’s surface by 2024.
The lander’s flexible design allows for the fastest path to lunar flights while providing a robust platform that can perform NASA’s full range of exploration missions. It can dock with the Gateway lunar orbiter or directly with NASA’s Orion to eliminate the need for an additional spacecraft, both on time to meet the 2024 mandate.
The design includes innovations in its engines, composites, and automated landing and rendezvous systems. Key technologies are based on the Boeing CST-100 Starliner spacecraft, which will be fully demonstrated and proven during its upcoming Orbital Flight Test to the International Space Station in December 2019.
Boeing partnered with NASA’s Marshall Space Flight Center, Johnson Space Center, and Kennedy Space Center and will collaborate closely with NASA to integrate, certify, and operate this innovative HLS. The company also will provide the critical resources and industry knowledge required to ensure on-time delivery in support of a 2024 lunar landing. Whether serving in NASA’s 2024 or 2025 mission slot, Boeing’s approach maximizes return from agency investments in previous and ongoing programs to allow for the simplest and therefore highest probability path back to the lunar surface.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Hirose Launches Solution Partner Network to Address Changing Design Challenges
05/06/2024 | HiroseHirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.