ON Semiconductor CEO Keith Jackson Elected Chair of Semiconductor Industry Association
November 8, 2019 | PR NewswireEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) Board of Directors today elected Keith Jackson, President, CEO, and Director of ON Semiconductor (NASDAQ:ON), as its 2020 Chair and Robert Bruggeworth, President, CEO, and Director of Qorvo (NASDAQ:QRVO), as its 2020 Vice Chair. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95% of U.S. semiconductor sales.
"It is a great pleasure to welcome SIA's outstanding leadership team for 2020: Keith Jackson of ON Semiconductor and Bob Bruggeworth of Qorvo," said John Neuffer, SIA President and CEO. "Keith is an accomplished and well-respected industry mainstay with a strong background in semiconductor technology. Bob is a dedicated industry leader and a superb advocate for semiconductor priorities. Together, their skills and experience will be a tremendous asset to SIA as we move the ball forward on policy priorities of great significance to our industry."
Jackson has more than 30 years of semiconductor industry experience and began serving as President, CEO, and Director of ON Semiconductor in November 2002. Before joining ON Semiconductor, he was with Fairchild, serving as Executive Vice President and General Manager, Analog, Mixed Signal, and Configurable Products Groups, and was head of its Integrated Circuits Group. Previously, Jackson served as President and a Member of the Board of Directors of Tritech Microelectronics in Singapore and worked for National Semiconductor Corporation, most recently as Vice President and General Manager of the Analog and Mixed Signal division. He also held various positions at Texas Instruments Incorporated, including engineering and management positions, from 1973 to 1986. Jackson earned his bachelor's and master's degrees from Southern Methodist University.
"Amid mounting global trade unrest and rising overseas competition, smart government policies are needed now more than ever to ensure continued U.S. leadership in semiconductor technology," said Jackson. "Our industry speaks with one voice through SIA to promote our interests in Washington and capitals around the world, and I look forward to helping guide that effort as 2020 SIA Chair."
Bruggeworth served as President and CEO of RFMD from January 2003 to December 2014, prior to the merger of RFMD and TriQuint to form Qorvo. He was previously President of RFMD from June 2002 until January 2003. Before this, he was also Vice President and then President of RFMD's wireless products group. Prior to joining RFMD in September 1999, Bruggeworth held various leadership positions at AMP Inc., a supplier of electrical and electronic connection devices, serving most recently as Vice President of Global Computer and Consumer Electronics. He is a graduate of Wilkes University, Wilkes-Barre, Pennsylvania.
"It is an honor to serve as 2020 SIA Vice Chair," Bruggeworth said. "Semiconductor technology is critical to America's economy, national security, and global technology leadership. I look forward to working alongside my colleagues at SIA to advance policies that strengthen the semiconductor industry and our country."
Suggested Items
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
It’s Only Common Sense: OCCAM—the Time Is Now
04/22/2024 | Dan Beaulieu -- Column: It's Only Common SenseOne of my favorite books is a little tome called Who Moved My Cheese? Even those of you who don’t spend a lot of time reading books have at least heard of it and know that it refers to people, especially in business, who are so stuck in their ways that they get upset when something changes. In our business, we know this kind of thinking is especially true. In fact, it always makes me laugh when one of my innovative friends finds a new way to do something and is afraid that someone will steal his idea. I always tell him that no one in our business, especially a PCB engineer, has ever thought about someone else’s innovative idea enough to steal it.
Digitalisation and ESG
04/19/2024 | Marina Hornasek-Metzl, AT&SDigitalisation and ESG are prominent and high-priority topics in the global business community. The first focuses on applying technology throughout the value chain to produce faster, smarter, and more desirable business outcomes. The latter emphasises the broader value a business is expected to create for its stakeholders from an environmental, social, and governance perspective.
Real Time with... IPC APEX EXPO 2024: Looking Back, Looking Forward With IEC
04/19/2024 | Real Time with...IPC APEX EXPOIEC came to the RTW booth and discussed both the legacy of IEC's past and the vision for its future. Industry veteran Bruno Ferri highlighted his quarter-century tenure in the industry and with IEC since its founding. He still exhibits boundless enthusiasm for the industry. Brando Stone, a young professional and a future face of IEC, talked about IEC's plans going forward and his experience at this year's IPC APEX EXPO.