TE's New Thermal Bridge Solution Significantly Improves Thermal Resistance Over Traditional Technologies
December 5, 2019 | TE ConnectivityEstimated reading time: 1 minute
TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, is introducing its thermal bridge technology that can provide up to two times better thermal resistance over traditional thermal technologies such as gap pads or thermal pads. As systems like servers, switches and routers deliver higher speeds and grow more sophisticated, their power requirements are rising, leading to a need for new solutions that can handle more heat. TE's thermal bridge solution offers superior thermal resistance, better reliability and durability, and allows for easier system serviceability than other comparable products on the market.
Optimized for input/output (I/O) applications using cold plates with liquid cooling or heat pipes, ganged heatsinks or direct chassis conduction applications with little to no airflow, TE's thermal bridge solutions feature a near-zero plate gap in the bridge construction for substantially improved thermal transfer and minimal levels of compression. In addition, the new solution delivers long-lasting and consistent thermal performance with an elastic compression design that is resistant to set or relaxation over time. This feature also helps to reduce component replacement during system servicing. The thermal bridge comes pre-assembled on the I/O cage and features an interleaved series of plates that allows heat to pass from the I/O module to the cooling area, while providing the necessary normal force, which is built into the thermal bridge.
"As engineers are designing their next-generation computing and networking systems, TE's thermal bridge can allow for simplified architectures and reduced component counts by eliminating the need for additional compression mechanisms, which traditional solutions require," said Zach Galbraith, product manager at TE Connectivity's data and devices business unit. "TE is a leader in thermal innovation, and our new thermal bridge solution delivers a whole new level of performance with higher durability."
TE's thermal bridge solutions are currently available for sample in SFP+, QSFP28 and QSFP-DD form factors.
Suggested Items
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
Saab Launches New Initiative to Shape the Future of Defense and Security
04/24/2024 | SaabSaab announces the launch of Skapa by Saab, a new initiative to accelerate the development and deployment of cutting-edge technologies and solutions.
LPKF Extends Contract of CEO Klaus Fiedler until 2028
04/24/2024 | LPKFThe Supervisory Board of LPKF Laser & Electronics SE has decided to extend the contract of Dr. Klaus Fiedler as CEO until 31 December 2028. "Under the leadership of Klaus Fiedler, LPKF has undergone some extensive transformation since he joined just over 2 years ago.
indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications
04/23/2024 | indie Semiconductorindie Semiconductor, Inc., an Autotech solutions innovator, has introduced a family of new high-performance video converters and retimers to enable in-cabin connectivity applications, including audio and video transport and device interfacing.
ZESTRON Welcomes Whitlock Associates as New Addition to their Existing Rep Team in Florida
04/19/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is thrilled to announce the addition of Whitlock Associates to its esteemed network of sales representatives.