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TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, will showcase a broad range of industry-leading high-speed data communications connectivity solutions at the DesignCon 2020 expo on Jan. 28-30, 2020, to be held at the Santa Clara Convention Center in California. TE offers a vast spectrum of powerful, ultra-compact solutions engineered to help optimize the latest data center innovations, delivering the speed, scalability, space-savings, improved thermals, power and reach that may be needed in an industry moving toward higher data rates.
TE's featured live demos will include:
- Octal Small Form-Factor Pluggable (OSFP), Quad Small Form-Factor Pluggable Double Density (QSFP-DD), Quad Small Form-Factor Pluggable (QSFP), Small Form-Factor Pluggable Double Density (SFP-DD), thermal bridge and other high-speed input/output (I/O) solutions for thermal management, disaggregation, density, improved channels, co-packaging, 5G and power delivery.
- Sliver internal connectors and cable assemblies, which have not only received industry recognition, but have been identified as the standard product across several industry forums and organizations like COBO, Gen-Z Consortium, EDSFF and Open Compute Project (OCP) for today and next-gen server and storage designs.
- Industry-leading STRADA Whisper high speed backplane connectors, with a continuously expanding range of configurations including direct plug orthogonal, mezzanine and cables all delivering at 56 Gbps, 112 Gbps and beyond.
- ERFV coax connectors, enabling next-generation 5G wireless designs by implementing antenna and radio board-to-board and board-to-filter connections at a lower cost with a one-piece design.
Nathan Tracy, TE Connectivity technologist and industry standards manager and OIF president, will be a guest speaker at the 112G OIF panel. The panel, titled "Enabling New Architectures: An Update on OIF's CEI-112G Electrical Interfaces," will be held Wednesday, January 28 at 3:45 p.m.