EV Group Establishes Heterogeneous Integration Competence Center
March 3, 2020 | PR NewswireEstimated reading time: 2 minutes
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG's process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging. These include solutions and applications for high-performance computing and data centers, the Internet of Things (IoT), autonomous vehicles, medical and wearable devices, photonics and advanced sensors.
The Heterogeneous Integration Competence Center™ combines EV Group’s world-class wafer bonding, thin-wafer handling, and lithography products and expertise, as well as pilot-line production facilities and services at its state-of-the-art cleanroom facilities.
EVG’s HI Competence Center is designed to help enable new products and applications driven by advances in system integration and packaging. Shown here: chiplet integration by collective die-to-wafer hybrid bonding.
The Heterogeneous Integration (HI) Competence Center combines EVG's world-class wafer bonding, thin-wafer handling, and lithography products and expertise, as well as pilot-line production facilities and services at its state-of-the-art cleanroom facilities at EVG's headquarters in Austria, supported by EVG's worldwide network of process technology teams. Through the HI Competence Center, EVG will help customers to accelerate technology development, minimize risk, and develop differentiating technologies and products through heterogeneous integration and advanced packaging all while guaranteeing the highest IP protection standards that are required for working on pre-release products.
"Heterogeneous integration fuels new packaging architectures and demands new manufacturing technologies to support greater system and design flexibility, as well as increased performance and lower system design costs," stated Markus Wimplinger, corporate technology development & IP director of EV Group. "EVG's new HI Competence Center provides an open access innovation incubator for our customers and partners across the microelectronics supply chain to collaborate while pooling our solutions and process technology resources to shorten development cycles and time to market for innovative devices and applications enabled by heterogeneous integration."
EVG has an extensive background in heterogeneous integration, providing solutions for this key technology trend for more than 20 years. Among these are: permanent wafer bonding—including direct fusion and hybrid bonding for 3D packaging and metal bonding—and die-to-wafer bonding with and without collective carriers for integration of III-V compound semiconductors and silicon as well as high-density 3D packaging; temporary bonding and debonding, including mechanical, slide-off/lift-off, and UV laser assisted; thin-wafer handling; and innovative lithography technologies, including mask aligners, coaters and developers, and maskless exposure/digital lithography.
Advanced Packaging Milestones
In the field of permanent bonding, EVG pioneered the patented SmartView® wafer-to-wafer alignment system more than 20 years ago, and has refined this technology over the years to support breakthrough technology advances such as backside-illuminated CMOS image sensors (BSI-CIS) and more recently the first demonstration of sub-100-nm wafer-to-wafer alignment overlay for hybrid bonding—enabling devices such as 3D BSI-CIS and memory-on-logic stacking. EVG developed the first temporary bonding systems for ultra-thin wafers as early as 2001, which are essential for 3D/stacked die packaging, as well as revolutionized low-temperature laser debonding for ultra-thin and stacked fan-out packages.
In lithography, EVG cemented its position as a recognized technology leader with the delivery of the first UV molding solutions for high-volume production of wafer-level optics more than a decade ago, and has since led the proliferation of nanoimprint lithography (NIL) to high-volume manufacturing (HVM). EVG continues to break speed and accuracy barriers in mask alignment lithography for advanced packaging and, more recently, unveiled the world's first highly scalable maskless exposure technology, which addresses emerging requirements in HVM back-end lithography.
Suggested Items
Orbex Secures £16.7m Investment for Rocket ‘Ramp Up’ Period
04/24/2024 | OrbexThe UK spaceflight company Orbex has received £16.7m from six backers in an update to its Series C funding round.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Real Time with... IPC APEX EXPO 2024: Advancements in Laser Depaneling with LPKF
04/24/2024 | Real Time with...IPC APEX EXPOJake Benz, LPKF sales manager for North America, discusses the company's advancements in laser depaneling. LPKF has introduced a green wavelength laser for processing rigid FR-4 circuit boards, bringing significant gains in processing speeds to market. The company transitioned from IR CO2 to UV wavelength due to heat and burning issues.
Adura Solutions Exhibits at Del Mar 2024
04/24/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year’s Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.