TRI Introduces New 3D AOI for the Semiconductor Industry


Reading time ( words)

 Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-resolution TR7700QE-S 3D AOI for the Semiconductor and Packaging Industry.

As the miniaturization of components and PCB boards increases, also does the demand for higher resolution inspection. The TR7700QE-S provides high accuracy and repeatability for the semiconductor & packaging industry. TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false calls rates.

The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. Powered by Metrology precision and flexible inspection algorithms, the TR7700QE-S can inspect and detect defects in wire bonds, die bonds, SMD, bumps, Wafer IC/Chip, underfill, and solder joints.

Share

Print


Suggested Items

What It Takes to Be a Milaero Supplier, Part 2

03/24/2020 | Anaya Vardya, American Standard Circuits
The decision to pursue military and aerospace (milaero) certification impacts every facet of the organization, and not every shop is prepared to make this transformation. In Part 2, Anaya Vardya focuses on what it takes to be a milaero supplier in the areas of engineering and CAM.



Copyright © 2020 I-Connect007. All rights reserved.