Eyelit’s FactoryConnect Selected by a Semiconductor Technology Leader to Optimize Factory Integration at Three Sites

Reading time ( words)

Eyelit Inc. is a manufacturing software provider for visibility, control, and coordination of manufacturing operations. Today Eyelit announced that a global leader in semiconductor manufacturing is deploying Eyelit’s FactoryConnect™ at multiple high-volume wafer fabs.

FactoryConnect is a configurable integration hub used to centralize connections, and coordinate information between various applications throughout a factory. FactoryConnect provides support for multiple protocols while managing real-time events and exceptions between independent systems. Within this deployment, FactoryConnect is used for exchanging information between various factory applications including an operator GUI, PROMIS MES, tool automation, reticle management, electronic logbooks, SPC, and OCAPS. Through centralized configuration, FactoryConnect efficiently defines and adapts operational scenarios between systems, rather than using point-to-point, hard-coded programming.

FactoryConnect offers faster, easier integration of factory devices including systems enabling smart factory.  It provides flexibility to visually create reusable business logic, with the ability to quickly change how systems interact without worrying about downtime.

“Previously we provided OperatorStation, SupervisorStation (GUI’s) and Workflow Manager (Harmon*Eyes) to help companies automate transactions between their legacy PROMIS™ MES and other systems”, stated Dan Estrada, Eyelit’s Vice-President of Sales and Marketing. “Today, FactoryConnect is our next-generation integration hub that empowers companies’ IoT and Industry 4.0 programs. FactoryConnect is MES independent. It can either integrate with or enable the replacement of the following legacy MES systems: Camstar, FactoryWorks, PROMIS and WorkSteam.”

With FactoryConnect, customers can also leverage other Eyelit software modules while keeping their own legacy MES solutions. These modules include: ADS™, Asset Management, EquipmentConnect, QMS, (8D, OCAP, RMA, NCR), RMS (recipe management), and SPC.



Suggested Items

Today’s MilAero Options: Outsourcing—‘Everybody’s Doing it’ Not so True Today

06/27/2016 | Marc Carter
There was a time, not so many decades ago, when that most commonly-stated mantra (“lower labor costs”) behind offshoring printed circuit fab (and some assembly) operations, still had some case-by-case validity.

New Tools for Human-Machine Collaborative Design

04/25/2016 | DARPA
Advanced materials are increasingly embodying counterintuitive properties, such as extreme strength and super lightness, while additive manufacturing and other new technologies are vastly improving the ability to fashion these novel materials into shapes that would previously have been extremely costly or even impossible to create.

Inkjet-printed Liquid Metal Could Bring Wearable Tech, Soft Robotics

04/08/2015 | Purdue University
New research shows how inkjet-printing technology can be used to mass-produce electronic circuits made of liquid-metal alloys for "soft robots" and flexible electronics.

Copyright © 2020 I-Connect007. All rights reserved.