GaN Systems Releases Best Performance Class-D Amplifier and Companion SMPS Evaluation Kit
May 14, 2020 | GaN SystemsEstimated reading time: 1 minute
GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, today announced the debut and availability of a new amplifier evaluation kit for high sound quality Class-D audio systems. The evaluation kit includes a 2 channel, 200W per channel (8 ohm) Class-D audio amplifier and companion 400W, continuous power audio-grade SMPS. This solution highlights an easy plug and play design with features such as multi-audio signal inputs, bridge-tied load output, and open-loop/closed-loop toggling. With GaN, the design is very efficient and operates without heatsinks. These features allow audio design engineers to create premium audio products at shorter time to market and at an affordable price.
The convergence of audio trends including demand for more power, size and weight reduction, and growing consumer demand for better audio quality requires innovative approaches to enhance sound quality, increase efficiency, and reduce size which is served by GaN power semiconductors. Applications include smart speakers to automotive and high-end home audio systems.
Evaluation Kit Performance
- 200W/Ch (8?), 300W/Ch (4?) amplifier with 96% efficiency
- 400W continuous, 550W peak companion SMPS
- < 0.01% THD+N (8?, 1W, 20Hz to 20kHz)
- +/?0.5dB frequency response to 50kHz
- High efficiency and no heatsinks, reducing size, weight, and total system cost
- Good EMI/EMC performance due to reduced ringing/noise
“Class-D Audio amplifiers are reaching a new level of performance with GaN. Industry experts and audiophiles alike have tested and listened to the output of our design and are truly impressed,” says Paul Wiener, GaN Systems’ Vice President of Strategic Marketing. “The audio quality combined with the thermal and EMI/EMC performance provide a great solution for our customers.”
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.