Eight U.S. Manufacturers Selected to Make NASA COVID-19 Ventilator


Reading time ( words)

After receiving more than 100 applications, NASA's Jet Propulsion Laboratory (JPL) in Southern California has selected eight U.S. manufacturers to make a new ventilator tailored for coronavirus (COVID-19) patients.

The prototype, which was created by JPL engineers in just 37 days, received an Emergency Use Authorization from the Food and Drug Administration on April 30.

Called VITAL (Ventilator Intervention Technology Accessible Locally), the high-pressure ventilator was designed to use one-seventh the parts of a traditional ventilator, relying on parts already available in supply chains. It offers a simpler, more affordable option for treating critical patients while freeing up traditional ventilators for those with the most severe COVID-19 symptoms. Its flexible design means it also can be modified for use in field hospitals.

NASA_Ventilators.jpg

The Office of Technology Transfer and Corporate Partnerships at Caltech, which owns the patents and software for VITAL, is offering a free license for the device. Caltech manages JPL for NASA.

The U.S. companies selected for licenses are:

  • Vacumed, a division of Vacumetrics, Inc. in Ventura, California
  • Stark Industries, LLC in Columbus, Ohio
  • MVent, LLC, a division of Minnetronix Medical, in St. Paul, Minnesota
  • iButtonLink, LLC in Whitewater, Wisconsin
  • Evo Design, LLC in Watertown, Connecticut
  • DesignPlex Biomedical, LLC in Fort Worth, Texas
  • ATRON Group, LLC in Dallas
  • Pro-Dex, Inc. in Irvine, California

"The VITAL team is very excited to see their technology licensed," said Leon Alkalai, manager of the JPL Office of Strategic Partnerships and a member of the VITAL leadership team. "Our hope is to have this technology reach across the world and provide an additional source of solutions to deal with the on-going COVID-19 crisis."

JPL now is evaluating international manufacturers from countries as diverse as Brazil, Mexico, India and Malaysia.

Share

Print


Suggested Items

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

12/01/2020 | I-Connect007 Editorial Team
This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

Additive Electronics TechXchange: NSWC Crane and Lockheed Martin Presentations

10/27/2020 | Happy Holden, I-Connect007
The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.



Copyright © 2021 I-Connect007. All rights reserved.