Soitec Inks Agreement with Qualcomm for 5G RF Filters


Reading time ( words)

Soitec (Euronext Paris), an industry leader in designing and manufacturing innovative semiconductor materials, announced a business agreement with Qualcomm Technologies, Inc., on the supply of piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters. Soitec’s piezoelectric-on-insulator substrate brings strong value proposition to smartphones’ 5G filters for mass markets.

An agreement to secure supply for Qualcomm Technologies’ new generation of RF filters

After multiple years of collaboration with Qualcomm Technologies, Soitec has concluded an agreement to bring POI wafers production to high volume manufacturing to be used for Qualcomm Technologies’ RF filters going to smartphones RF front end modules.

“With our game-changing thin-film technology and innovation in the Qualcomm® ultraSAW RF filter products, we continue to push the boundaries of what’s possible in mobile technology,” said Christian Block, senior vice president and general manager, RFFE, Qualcomm Germany RFFE GmbH. “This agreement with Soitec is key to ensure the supply of high-performance POI substrates from Soitec, and to securely support the demand from our OEM customers for high-performance Qualcomm ultraSAW RF filter products. The combination of Soitec Smart CutTM based Piezoelectric-On-Insulator substrates and Qualcomm Technologies’ filter design and system expertise leads to high-yield multiplexers with multiple filter functions per die.”

Soitec’s POI substrate chosen for its unique value for RF filters

POI is an innovative substrate manufactured thanks to Soitec’s proprietary Smart CutTM technology in 150 mm. At its foundation lies a high resistivity silicon substrate, complemented by a buried oxide layer and a very thin and uniform layer of a mono-crystal piezo material on top. Soitec’s POI engineered substrates have been designed to build the latest generation of 4G/5G Surface Acoustic Wave (SAW) filters. They offer performance with built-in temperature compensation.

“This business agreement is the outcome of a collaboration between Soitec and Qualcomm Technologies. We are very pleased that Soitec POI substrates are now an important part of Qualcomm Technologies’ 5G offering for mobile devices,” said Dr. Bernard Aspar, Senior Executive Vice President of Soitec’s Global Business Units. “Soitec has a long experience in serving RF markets notably with large RF-SOI volumes. We are confident in our ability to handle high-volume production for POI to become a standard in materials for 5G RF filters, thanks to our robust and proven Smart CutTM technology.”

Share

Print


Suggested Items

CES 2020: The Intelligence of Things

01/06/2020 | Nolan Johnson, I-Connect007
Show week for CES 2020 starts well ahead of the actual exhibition dates because it is huge. The organizers of CES state that there are more than 4,400 exhibiting companies and nearly three million net square feet of exhibit space. On the floor, you can find 307 of the 2018 Fortune Global 500 companies. Over the week, I-Connect007 Editors Dan Feinberg and Nolan Johnson will bring you some of the most interesting news, products, and announcements from 5G to IoT, semiconductor developments, autonomous vehicle technology, interconnect, fabrication materials, and much more.

NASA Sounding Rocket Technology Could Enable Simultaneous, Multi-Point Measurements — First-Ever Capability

10/21/2019 | NASA
NASA engineers plan to test a new avionics technology — distributed payload communications — that would give scientists a never-before-offered capability in sounding rocket-based research.

For Climbing Robots, the Sky's the Limit

07/15/2019 | NASA
Robots can drive on the plains and craters of Mars, but what if we could explore cliffs, polar caps and other hard-to-reach places on the Red Planet and beyond? Designed by engineers at NASA's Jet Propulsion Laboratory in Pasadena, California, a four-limbed robot named LEMUR (Limbed Excursion Mechanical Utility Robot) can scale rock walls, gripping with hundreds of tiny fishhooks in each of its 16 fingers and using artificial intelligence (AI) to find its way around obstacles.



Copyright © 2020 I-Connect007. All rights reserved.