X-FAB On Track to Resume Production After Cyber Attack
July 13, 2020 | X-FAB GroupEstimated reading time: 1 minute
X-FAB Group, whose IT systems and production lines were stopped to prevent damage following the cyber attack on July 5, resumed production at one of its manufacturing sites. All other sites will follow within a week's time frame from now.
The majority of X-FAB's customers and business partners was notified of the event. X-FAB does not expect a major impact on its business. Most orders are foreseen to be executed within the third quarter, only some deliveries may have to be shifted to the fourth quarter after close alignment with the respective customers. In response to the production stop after the cyber attack, X-FAB had pulled forward the two-week fab shutdowns initially planned to take place later in the third quarter as part of its COVID-19 cost-saving initiative. After a detailed check, X-FAB does not anticipate damage to the work in progress caused by the sudden stop of its production lines.
Investigations meanwhile revealed that it was a so-called Maze ransomware attack. This type of attack is generally known for demanding a ransom for decryption of data as well as for misusing data.
The financial impact of the cyber attack is not expected to be material. There will be an additional investment to improve IT security. Together with external cyber security experts, X-FAB worked out a strategy to gradually and safely resume all systems while making the company's IT infrastructure more robust and secure going forward.
X-FAB's priority now is to resume production at all manufacturing sites. All other IT related systems will follow. Under these circumstances, the publication of the second quarter results initially planned for July 30 will be postponed to August 27, 2020.
Suggested Items
Camtek Receives Approx. $25M from tier-1 manufacturer for High Bandwidth Memory (HBM)
03/29/2024 | CamtekCamtek Ltd. announced that it has received a new order for approximately $25 million from a tier-1 HBM manufacturer, for the inspection and metrology of High Bandwidth Memory (HBM). Most of the systems are expected to be delivered in the second half of 2024.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.