Samsung Releases Silicon-Proven 3D IC Technology
August 13, 2020 | Samsung ElectronicsEstimated reading time: 1 minute
Samsung Electronics, a world leader in advanced semiconductor technology, announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today’s most advanced process nodes. Leveraging Samsung’s through-silicon via (TSV) technology, X-Cube enables significant leaps in speed and power efficiency to help address the rigorous performance demands of next-generation applications including 5G, artificial intelligence, high-performance computing, as well as mobile and wearable.
“Samsung’s new 3D integration technology ensures reliable TSV interconnections even at the cutting-edge EUV process nodes,” said Moonsoo Kang, senior vice president of Foundry Market Strategy at Samsung Electronics. “We are committed to bringing more 3D IC innovation that can push the boundaries of semiconductors.”
With Samsung’s X-Cube, chip designers can enjoy greater flexibility to build custom solutions that best suit their unique requirements. The X-Cube test chip built on 7nm uses TSV technology to stack SRAM on top of a logic die, freeing up space to pack more memory into a smaller footprint. Enabled by 3D integration, the ultra-thin package design features significantly shorter signal paths between the dies for maximized data transfer speed and energy efficiency. Customers can also scale the memory bandwidth and density to their desired specifications.
Samsung X-Cube’s silicon-proven design methodology and flow are available now for advanced nodes including 7nm and 5nm. Building on the initial design, Samsung plans to continue collaborating with global fabless customers to facilitate the deployment of 3D IC solutions in next-generation high-performance applications.
Suggested Items
Orbex Secures Patent for 'Petal Fold' Reusable Rocket Technology
03/29/2024 | OrbexOrbex has successfully patented its REFLIGHT reusable rocket technology following patent approval in several European markets, based on the patent grant by the European Patent Office, as well as in the United States.
Intel Announces 2024 EPIC Supplier Program Award Recipients
03/29/2024 | Intel CorporationIntel announced the recipients of the 2024 Intel EPIC Supplier Program awards, which recognize suppliers that exemplify Intel’s standard of excellence. Intel is committed to expanding global supply capacity, delivering leadership products and enabling Intel Foundry.
NEOTech Promotes Emilio Ramirez to Chief Technology Officer
03/29/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is thrilled to announce the promotion of Emilio Ramirez to the position of Chief Technology Officer (CTO).
Keynote Preview: Reshaping our Engagement With the World
03/28/2024 | Shawn DuBravac, IPCThe widespread integration of AI across various sectors is broadening its impact, from revolutionizing healthcare with Smart solutions to transforming homes into intuitive spaces, highlighting its crucial role in boosting efficiency and addressing complex challenges. In healthcare, we're witnessing a trend toward personalized care with AI-driven devices like intelligent pillows to mitigate snoring, sophisticated sleep monitors, and innovative patient monitoring systems.
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.