Arm and DARPA Partner to Accelerate Technological Innovation


Reading time ( words)

Arm announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm® technology. With DARPA’s Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA’s programs to quickly and easily take advantage of Arm’s leading IP, tools and support, accelerating innovation in a variety of fields.

“The span of DARPA research activity opens up a huge range of opportunities for future technological innovation,” said Rene Haas, president, IP Products Group, Arm. “Our expanded DARPA partnership will provide them with access to the broadest range of Arm technology to develop compute solutions supported by the world’s largest ecosystem of tools, services and software.”

With more than 170 billion Arm-based chips shipped to date, Arm offers the industry’s most proven IP, providing distributed intelligence from cloud to edge and endpoint. The expanded partnership enables DARPA researchers to have the flexibility and scalability to access vertical market compute from small embedded sensors to high-performance systems.

“DARPA’s programs within the Microsystems Technology Office (MTO) focus on the most advanced challenges in microelectronics; equipping our community with best in class technologies is essential not only for break-through scientific and engineering advances, but also for improved transition into military and commercial applications,” stated Serge Leef, who leads design automation and secure hardware programs in MTO.

To support the work DARPA does, multidimensional collaboration is key. An Arm IP license gives the DARPA community a portal to the world’s largest open compute ecosystem of silicon designers and software developers, enabling the lowest SoC build costs and smallest risk profile. Projects can transition from concepts to real-world deployments in a fast and efficient way, with guidance on everything from hardware verification to physical implementation and software development.

Share

Print


Suggested Items

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

Additive Electronics TechXchange: NSWC Crane and Lockheed Martin Presentations

10/27/2020 | Happy Holden, I-Connect007
The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.

Understanding MIL-PRF-31032, Part 4

10/20/2020 | Anaya Vardya, American Standard Circuits
Continuing with Part 4 of the discussion on understanding the military PCB performance standard MIL-PRF-31032, Anaya Vardya explains how the next step in the process is to create four new procedures to address the unique requirements of the military.



Copyright © 2020 I-Connect007. All rights reserved.