Efabless Extends Partnerships for Rapid Development Solution of Custom ICs


Reading time ( words)

Efabless Corporation,  the leading open innovation platform for IC design, announced a collaboration with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies to support customers with low-cost rapid solutions for IC development. The solutions enable a broad range of customers with diverse areas of expertise, to create or have created, custom ICs supporting their products or technologies. The partnership enhances these solutions to leverage imec’s world-class supply chain solution for fabrication, assembly and test.

The solution is based on automated configurable design templates. The initial SoC Design Templates are based on X-FAB 180nm process technology and include a broad selection of analog and digital peripherals that can be readily configured into a design.

By choosing templates based on specific application requirements, custom SoC designs are automatically generated from a web-based UI using drop-down menus. The solution enables designers to create a complete SoC without needing expertise for the full chip design. For customers who need turn-key or partial design services, cost and time-to-market can be reduced as much as 3-5x through leveraging automated design generation and development on the Efabless platform.

Custom analog or digital block can be readily incorporated enabling further customization and providing a means to create a complete controller around customer developed IP. The solution is great for customers looking to build initial POCs or developing first product iterations. Unlike FPGAs, custom ICs (ASICs) support rich analog and digital mixed-signal designs and can provide better speed, cost and power consumption.

Romano Hoofman, Program Director at imec comments: “For many years, imec has supported customers and provided them with access to leading-edge foundries such that those customers can realize their ideas in silicon. The Efabless platform is great for customers who are looking for a low-cost, easy and fast route to fabrication of their ASIC solutions. Our collaboration will start with support for the XH018 technology from X-FAB, but we will add more technologies and foundries to the Efabless platform in the coming years.”

“We are very excited to be working with imec to eliminate traditional barriers for IC creation. We share a common vision for a simplified solution to address a large growing demand for custom electronics driven by requirements for intelligent connected products. By providing a complete path for many more designers to quickly and cost-effectively turn their innovative ideas into commercial products, imec and Efabless are taking a big step in making this vision a reality,” said Jeff DiCorpo, SVP Business Development at Efabless.

Share

Print


Suggested Items

Kirigami Inspires New Method for Wearable Sensors

10/22/2019 | University of Illinois
As wearable sensors become more prevalent, the need for a material resistant to damage from the stress and strains of the human body’s natural movement becomes ever more crucial. To that end, researchers at the University of Illinois at Urbana-Champaign have developed a method of adopting kirigami architectures to help materials become more strain tolerant and more adaptable to movement.

Worldwide Semiconductor Equipment Billings at $13.3 Billion in 2Q19; Down 20%

09/12/2019 | SEMI
Worldwide semiconductor manufacturing equipment billings reached $13.3 billion in the second quarter of 2019, down 20% from the same quarter of 2018 and 3% from than the previous quarter.

Designing Chips for Real Time Machine Learning

04/01/2019 | DARPA
DARPA’s Real Time Machine Learning (RTML) program seeks to reduce the design costs associated with developing ASICs tailored for emerging ML applications by developing a means of automatically generating novel chip designs based on ML frameworks.



Copyright © 2020 I-Connect007. All rights reserved.