STMicroelectronics, Qualcomm Partner on Sensor Solutions
November 10, 2020 | Business WireEstimated reading time: 1 minute
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is extending its leadership in sensor technologies by developing innovative software solutions using technology from Qualcomm Technologies, Inc. through the Qualcomm® Platform Solutions Ecosystem program.
In this program, ST is contributing pre-validated software to OEMs for its MEMS and other sensing devices to deliver advanced features to the next generation of smartphones, connected PCs, IoT, and wearables. Most recently, Qualcomm Technologies has pre-selected ST’s latest high-accuracy, low-power, motion-tracking IC with intelligent sensor software, along with ST’s most accurate pressure sensor, for use in its latest advanced 5G mobile reference platforms.
The motion-tracking sensor, the new iNEMO LSM6DST is a 6-axis Inertial Measurement Unit (IMU) that integrates a 3-axis digital accelerometer and a 3-axis gyroscope into a compact and efficient System-in-Package. With the industry’s lowest power consumption – 0.55mA in high-performance mode and as little as 4mA in Accelerometer-only mode -- the LSM6DST enables always-on high-accuracy motion tracking with minimal impact on power consumption. In concert with ST’s low-noise (0.65Pa), high-accuracy (±0.5hPa), and industry-first I3C-enabled LPS22HH pressure sensor, the pair provides highly accurate location tracking while meeting the most restrictive power budgets.
For imaging applications, the LSM6DST fully supports EIS and OIS (Electronic and Optical Image Stabilization) applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer and, in turn, the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM) can configure the OIS.
Benefiting from ST’s robust and mature low-power ThELMA1 process technology, the LSM6DST supports and simplifies integration in low-power circuit designs and offers I²C, MIPI I3C® or SPI from the sensing element to the application. It also contains a 9-kbyte FIFO to allow dynamic data batching and 16 finite state machines that recognize programmed data sequences from the sensor and further reduce system-level power consumption.
Suggested Items
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.
NetVia Group Acquires Direct Imaging from Mivatek
04/09/2024 | Miva TechnologiesMiva Technologies is pleased to announce NetVia Group, Irving, TX has acquired a new Miva 2400NG Dual Tray Direct Imaging System with 30-micron capabilities for inner, outer and soldermask imaging.
Teledyne to Acquire Adimec
02/13/2024 | TeledyneTeledyne Technologies Incorporated announced that it has entered into an agreement to acquire Adimec Holding B.V. and its subsidiaries.
Real Time with... productronica 2023: MivaTek Global Advances Technology With High-res Imaging System
12/08/2023 | Real Time with...productronicaMivaTek's Brendan Hogan talks about how the company employs Digitally Adaptive Rasterization Technology (DART) in their high-res imaging equipment. He also shares how the blurred line between semiconductors and microelectronics is driving broader application of the imaging process.
Keysight Enables Validation of Arbe 4D Imaging Radar Chipset
11/30/2023 | Keysight Technologies, Inc.Keysight Technologies, Inc. announces that Arbe has selected the E8719A Radar Target Solution (RTS) to test the Arbe 4D imaging radar chipset for automotive applications.