Pinnacle Imaging Systems Announces Denali 3.0 ISP
November 11, 2020 | PRWEBEstimated reading time: 1 minute
Pinnacle Imaging Systems™, a developer of Image Signal Processors (ISP) and High Dynamic Range (HDR) video solutions, launched its new Denali™ 3.0 Programmable Image Signal Processor IP. Pinnacle Imaging’s camera-ready, end-to-end HDR ISP leverages its proprietary advanced algorithms to accurately tone map high contrast scenes for mission critical applications requiring data-rich, real-time imaging. With Denali 3.0, Pinnacle Imaging has redesigned its ISP for more efficient power consumption, boosted performance with an expanded 20-bit image processing pipeline and limited latency to less than 20 lines, all with no external DRAM or frame buffers required. These improvements ensure Denali 3.0 delivers best-in-class image quality for applications demanding native support of real-time high dynamic range video for automotive, security and surveillance, robotics, medical, industrial, machine vision and automated sensory applications.
“As designers continue to expand sensor-based safety mechanisms for ADAS and autonomous robotic applications, the need for ultra-low latency, and high-quality visual data advances at every stage; with Denali 3.0, we are providing the building blocks for the future of these technologies,” said Alfred Zee, CEO of Pinnacle Imaging Systems. “The opportunity to collaborate with industry leaders like Xilinx, Inc. and ON Semiconductor has afforded us a unique opportunity to build on our high dynamic range ISP and meet the demands of next generation platforms that will service applications of the future.”
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsIn this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.