Ascent Announces the Availability of a New Robotics Solution


Reading time ( words)

Ascent Robotics unveils a powerful but easy-to-deploy bin-picking solution for manufacturing industries around the world, called Ascent Pick. Ascent Pick uses inexpensive and readily available cameras and features an easy-to-use web-based UI – dramatically minimizing both infrastructure costs and programming overhead for manufacturers eager to leverage modern industrial advances in computer vision that promise to accelerate growth and profitability.

In the manufacturing sector, robotic bin picking is vital to operating efficiencies and optimal workforce management as it frees workers from needing to perform tedious and monotonous tasks.  According to Eric Truebenbach, Director of Corporate Development at Teradyne, in his The Robot Report in article "Is fully automated bin picking finally here?", an estimated 38% of the manufacturing workforce moves parts between bins and the machines that manipulate these parts.  The Ascent Pick solution features an innovative AI algorithm that can understand what it 'sees' with a simple RGBD camera, distinguishing between complex and differently shaped objects without the need for learning with real data or manual labeling of data.   Moreover, the Ascent Pick software and accompanying web-based UI supports many different robots manufactures and types, as well as grippers.

The Ascent Pick solution and user interface were designed and developed in close collaboration with key industry partners and is now commercially available from the Ascent Website or through one of their partner distributors or system integrators.  "I am excited to announce the availability of Ascent Pick, making industrial AI profoundly more useful and accessible thanks to our unique combination of sophistication with simplicity", says Ken Kutaragi, CEO of Ascent Robotics "this will be the first of many industrial AI solutions we plan to, as we say, make in Japan and make for the World."

Share

Print


Suggested Items

Today’s MilAero Options: Outsourcing—‘Everybody’s Doing it’ Not so True Today

06/27/2016 | Marc Carter
There was a time, not so many decades ago, when that most commonly-stated mantra (“lower labor costs”) behind offshoring printed circuit fab (and some assembly) operations, still had some case-by-case validity.

New Tools for Human-Machine Collaborative Design

04/25/2016 | DARPA
Advanced materials are increasingly embodying counterintuitive properties, such as extreme strength and super lightness, while additive manufacturing and other new technologies are vastly improving the ability to fashion these novel materials into shapes that would previously have been extremely costly or even impossible to create.

Inkjet-printed Liquid Metal Could Bring Wearable Tech, Soft Robotics

04/08/2015 | Purdue University
New research shows how inkjet-printing technology can be used to mass-produce electronic circuits made of liquid-metal alloys for "soft robots" and flexible electronics.



Copyright © 2021 I-Connect007. All rights reserved.