It’s Only Common Sense: How to Win Back Lost Customers
Punching Out: M&A North American PCB and EMS Deals for the First Half of 2025
The Chemical Connection: Sales Organization from a Capital Equipment Perspective
Tower Semiconductor Participates in DARPA LUMOS program
January 5, 2021 | Globe NewswireEstimated reading time: Less than a minute
Tower Semiconductor, a leader in high-value analog semiconductor foundry solutions, announced that it is participating in the LUMOS program, with partial support from DARPA, to create a semiconductor foundry integrated-laser-on-silicon photonics process. This process will combine high-performance III-V laser diodes with Tower’s PH18 production silicon photonics platform. Multi-project wafer runs (MPW) will be coordinated with the new process, when ready. The initial versions of the PDK (process development kit) are expected in 2021 and will include laser and amplifier blocks.
The benefits of laser integration on silicon include an increase in the density of lasers, a reduction of coupling losses between the laser and the photonics, a reduction in components required, and a much-simplified packaging scheme. When combined with Tower’s rich suite of passive and active silicon photonics elements -- such as silicon and silicon-nitride waveguides, Mach-Zehnder modulators (MZM), and Ge photodiodes -- the co-integration will enable new products unavailable today from a volume semiconductor or photonics foundry.
The advanced process will be part of DARPA’s Lasers for Universal Microscale Optical Systems (LUMOS) program, which aims to bring high-performance lasers to advanced photonics platforms, addressing commercial and defense applications.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
Marcy’s Musings: From Pitch to PO—The Sales Stack
07/21/2025 | Marcy LaRont -- Column: Marcy's MusingsIt is a foundational truth that a company lives and dies by its sales. Receiving that PO or contract starts the operational chain. It is the purest symbol of the machinations of the business process: You are paying me for something I am doing, making, or sourcing for you. Then, every single thing a business does in executing and fulfilling that sales agreement speaks directly to customer experience and whether more POs will follow. You won't keep customers if you don't make a quality product and provide strong customer service.
July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Tightening of LPDDR4X Supply Drives Up Prices; Smartphone Brands to Accelerate Adoption of LPDDR5X
07/17/2025 | TrendForceTrendForce’s latest investigations reveal that major Korean and U.S. memory suppliers are expected to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.