Intel to Invest $3.5 Billion to Expand New Mexico Manufacturing Operations
May 4, 2021 | Intel CorporationEstimated reading time: 2 minutes
Intel Corporation will invest $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, Intel’s breakthrough 3D packaging technology. The multiyear investment is expected to create at least 700 high-tech jobs and 1,000 construction jobs and support an additional 3,500 jobs in the state. Planning activities begin immediately, with construction expected to start in late 2021.
“A key differentiator for our IDM 2.0 strategy is our unquestioned leadership in advanced packaging, which allows us to mix and match compute tiles to deliver the best products. We’re seeing tremendous interest in these capabilities from the industry, especially following the introduction of our new Intel Foundry Services. We’re proud to have invested in New Mexico for more than 40 years and we see our Rio Rancho campus continuing to play a critical role in Intel’s global manufacturing network in our new era of IDM 2.0,” says Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations.
Foveros advanced 3D packaging technology enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller footprint. It also allows Intel to mix and match compute tiles to optimize for cost and power efficiency. The move from system-on-chip to “system on package” will enable Intel to meet increasing computing performance needs for artificial intelligence, 5G and the edge.
Intel’s global factory network is a competitive advantage that enables product optimization, improved economics and supply resilience. Investing in the company’s manufacturing operations is a key component of its recently announced IDM 2.0 strategy. The technologies currently developed and manufactured at the Rio Rancho site — Intel® Optane™ technology, embedded multi-die interconnect bridge and Intel® silicon photonics technology — play important roles in Intel’s new era of innovation by simplifying and optimizing semiconductor memory, packaging, and connectivity.
“Intel’s $3.5 billion investment in New Mexico will create 700 new jobs in the next three years and establish the Rio Rancho campus as the company's domestic hub for advanced semiconductor manufacturing,” said New Mexico Gov. Michelle Lujan Grisham. “With this exciting development, we are already seeing the benefits of this year's legislation expanding LEDA, generating high-quality and high-paying jobs for New Mexicans. The state and Intel have a 40-year partnership, and today, with innovative economic development tools and global demand for this technology, we can celebrate a new generation of workers and job growth at Intel’s New Mexico manufacturing plant.”
About Intel in New Mexico: Since 1980, Intel has invested $16.3 billion in capital to support its New Mexico operations and currently employs more than 1,800 people at the site. Its annual economic impact in the state is $1.2 billion, based on 2019 data.
Intel is committed to corporate responsibility and addressing community needs. The company purchases renewable energy to meet 100% of its New Mexico electricity use and invests in energy-saving measures. To reach its goal of achieving net positive water use by 2030, Intel has funded two nonprofit-led water restoration projects benefiting New Mexico. Over the past five years, employees volunteered 106,000 hours and Intel and the Intel Foundation donated more than $8.5 million in support of New Mexico schools and nonprofits.
Suggested Items
Cogiscan Collaborates with Koh Young to Unveil How Factory Insights Software Transforms Data Into Action at IPC APEX EXPO
03/28/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, is excited to announce Factory Insights, the latest offering from Cogiscan, will be demonstrated alongside KSMART in Koh Young booth 2112 during IPC APEX Expo.
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
03/27/2024 | SEMIMore than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York.
NextFlex Announces $5M Education Fundraising Effort: First Spotlight - Transforming the Landscape for Women in Technology
03/27/2024 | BUSINESS WIRENextFlex Learning Programs, the education-focused arm of the NextFlex® Hybrid Electronics Manufacturing Innovation Institute, announces its first spotlight effort, “NextFlex Supports Women in STEM” to increase the number of women in STEM fields, which could accelerate U.S. GDP growth by boosting women’s cumulative earnings by $299B and adding $5.9T to the global stock market within 10 years according to S&P Global.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.
ACDi Takes Milestone Delivery of the 23,000th Koh Young Machine
03/26/2024 | ACDiAccording to ACDi (American Computer Development, Inc.), “Flexible, reliable, and equipped to keep your project on schedule, is what you need as an electronics manufacturing services partner.”