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TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms

03/12/2024 | JCN Newswire
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature fired paste for gold-to-gold bonding.

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.

Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

01/12/2024 | Indium Corporation
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco.

Smart Factory Insights: The Sustainability Gold Rush

01/02/2024 | Michael Ford -- Column: Smart Factory Insights
A gold rush represents an opportunistic, get-rich-quick scheme. With just one or very few potential winners in each case, most participants are left disappointed with their share, especially when compared to how much effort they put in. These scenarios are usually not thought through very well, even by the winners. When it comes to sustainability in manufacturing, I’ve seen a gold rush of sorts to find solutions, but the pieces are disjointed and not uniform. Sustainability needs to be a forever thing—not a race to find gold, but rather a race to work together.

Texas Instruments’ New Manufacturing Plant in North Texas Achieves LEED Gold Version 4

09/04/2023 | Texas Instruments
Texas Instruments (TI) announced its new 300-mm semiconductor wafer fabrication plant in Richardson, Texas, RFAB2, achieved LEED (Leadership in Energy and Environmental Design) Gold certification under version 4 (v4).
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