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Indium Corporation to Present, Exhibit at EPP InnovationsFORUM

03/28/2024 | Indium Corporation
Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.

TRI Launches New Advanced Packaging 3D CT AXI Solution

03/26/2024 | TRI
Test Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.

ECWC16 Technical Conference Special Sessions

03/20/2024 | Julia Gumminger, IPC
The ECWC16 Technical Conference at IPC APEX EXPO 2024 will feature two curated Special Technical Sessions on Thursday, April 11. Building on the success of similar sessions last year, these sessions will feature leaders in the advanced packaging and e-mobility segments, focusing on technological challenges and innovations. Both sessions were curated by the Technical Program Committee (TPC), consisting of subject matter experts in their fields.

Dr. Jennie Hwang to Deliver Courses on AI, High Reliability at IPC APEX EXPO 2024

03/05/2024 | Dr. Jennie Hwang
Dr. Jennie Hwang will deliver two Professional Development Courses on “Artificial Intelligence Era—Opportunities, Challenges, Possibilities” (PD21), and “High Reliability Electronics for Harsh Environments” (PD7) at IPC APEX 2024 on Sunday, April 7 and Monday, April 8, respectively. Hwang, chair of the AI Committee of National Academies/DoD AI study, Panel of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course.

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.
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