Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IDTechEx Discusses AiP Market Dynamics: Drivers and Challenges in 5G and 6G

04/04/2024 | PRNewswire
Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas.

Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

10/20/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced that it has won four Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.

iNEMI & ZESTRON Workshop: Advanced Packaging and its Impact on mm/Wave Applications

10/18/2023 | iNEMI
A workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023  at 9:00 a.m.-5:00 p.m.

iNEMI Workshop on Advanced Packaging and Its Impact on mm/Wave Applications

10/13/2023 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to co-sponsor the upcoming workshop, "Advanced Packaging and its Impact on mm/Wave Applications," in collaboration with the International Electronics Manufacturing Initiative (iNEMI).

5G/6G MAESTRO Roadmap on Low Loss Dielectric Materials Characterization Available Online

08/18/2023 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the Low Loss Dielectric Materials Characterization Roadmap, which is part of the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO).
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in