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Siemens, NVIDIA Expand Collaboration on Generative AI for Immersive Real-time Visualization

03/19/2024 | PRNewswire
Siemens announced that it will deepen its collaboration with NVIDIA to help build the industrial metaverse. Siemens is bringing immersive visualization powered by new NVIDIA Omniverse Cloud APIs to the Siemens Xcelerator platform, driving increased use of AI-driven digital twin technology.

Nepes Expands IC Packaging Capabilities for the 3D-IC era with Advanced Design Flows from Siemens

03/08/2024 | Siemens
Siemens Digital Industries Software announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D-IC packages.

Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry

03/04/2024 | Siemens
Siemens Digital Industries Software announced it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.

Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry

02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.

FPT and Siemens Ink MOU, Accelerating Multifaceted Cooperation Globally

02/29/2024 | BUSINESS WIRE
Global IT corporation FPT recently signed a Memorandum of Understanding (MoU) with the multinational industrial technology conglomerate Siemens, fostering collaboration and mutually beneficial business opportunities in advancing the manufacturing sector and semiconductor chip production while accelerating digital transformation globally.
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