Qualcomm Unveils New Features in Snapdragon X70 Modem-RF System


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Qualcomm Technologies, Inc., announced at the Qualcomm 5G Summit event new capabilities and milestones for the Snapdragon X70 5G Modem-RF System. These accomplishments build upon the fifth-generation 5G modem-to-antenna solution announced in February at MWC Barcelona. Harnessing the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads, incredible upload speeds, low latency, coverage, and power efficiency, Snapdragon X70 offers ultimate flexibility to global 5G operators to maximize spectrum resources for the best possible 5G connectivity. Snapdragon X70 provides advanced capabilities such as Qualcomm 5G AI Suite, Qualcomm 5G Ultra-Low Latency Suite, Qualcomm 5G PowerSave Gen 3, uplink carrier aggregation, standalone mmWave and 4X sub-6 carrier aggregation to achieve unmatched 5G performance.

New features and achievements facilitated by the upgradable architecture of Snapdragon X70 include:

Qualcomm Smart Transmit 3.0 technology, an upgraded system-level feature licensed by Qualcomm Technologies that now extends support to Wi-Fi and Bluetooth® transmit power management. It enables real-time averaging of transmit power across 2G-5G, mmWave, Wi-Fi (2.4GHz 6/6E/7), and Bluetooth (2.4) radios to superior radio performance.

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Smart Transmit 3.0 extends 5G coverage and improve uplink speeds, optimizing transmissions across cellular, Wi-Fi and Bluetooth antennas. Smart Transmit 3.0 helps devices smartly manage transmit power, allowing users to enjoy faster, more reliable connectivity.

The world’s first 5G standalone mmWave connection, with peak speeds of more than 8 Gbps achieved using Keysight’s 5G Protocol R&D Toolset with a test 5G device powered by Snapdragon X70. The milestone took place in Qualcomm Technologies’ 5G Integration and Test labs in San Diego. 5G standalone mmWave allows for the deployment of 5G mmWave networks and devices without using an anchor on sub-6 GHz spectrum. This gives operators more flexibility to deliver wireless fiber broadband access with multi-Gigabit speeds and ultra-low latency to residential and commercial customers. Through this product demonstration, Qualcomm Technologies illustrates its commitment to new and world-class 5G advancements for devices and networks.

“Snapdragon X70 gives operators the ability to deliver extreme 5G capacity, multi-Gigabit data speeds, and new use cases across devices from smartphones to laptops, fixed wireless access equipment, industrial machines, and more,” said Durga Malladi, senior vice president and general manager, cellular modems and infrastructure, Qualcomm Technologies, Inc. “We look forward to working with industry leaders to advance 5G to power best-in-class connectivity experiences at the connected intelligent edge and transform industries across consumer, enterprise and industrial settings.”

At the Qualcomm 5G Summit event, the Company also demonstrated other Snapdragon X70 capabilities, such as AI-enhanced 5G performance, and 5G sub-6 GHz carrier aggregation across three TDD channels – delivering up to 6 Gbps peak download speeds. 5G carrier aggregation enables enhanced average speeds and more robust connections in challenging conditions, such as cell-edge far from the cellular base stations.

Snapdragon X70 is currently sampling to customers. Commercial mobile devices based on Snapdragon X70 are expected to launch by late 2022.

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