Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Koh Young America Appoints Heriberto Cuevas as Sales Team Leader for Mexico and South America

03/19/2024 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions, proudly announces the appointment of Heriberto Cuevas as the Sales Team Leader for its Mexico and South America operations.

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

03/18/2024 | IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry. 

Altium to Exhibit Latest Innovations at Embedded World 2024

03/15/2024 | Altium
Altium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer,

Intel Appoints Stacy Smith to Board of Directors

03/14/2024 | BUSINESS WIRE
Intel Corporation announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.

onsemi Aligns Business Groups to Expand Product Portfolio and Accelerate Growth

03/13/2024 | onsemi
onsemi announced the formation of the Analog and Mixed-Signal Group (AMG) which will be led by newly appointed group president, Sudhir Gopalswamy.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in