Cadence, Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology
October 4, 2022 | Business WireEstimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Samsung Foundry has certified an 8nm RFIC design reference flow to develop 5G RFICs for use with sub-6GHz to millimeter wave (mmWave) applications. The flow’s advanced design methodology and unique features deliver added productivity, comprehensive electrical analysis and faster design closure to help customers implement high-quality RFIC designs with the first pass. The new flow helps joint Cadence and Samsung Foundry customers meet the growing global demand for 5G client devices, including smartphones and communications infrastructure equipment such as cellular base stations.
The design flow allows customers to quickly and easily compare circuit simulation results with pre-layout schematics, identify in-design electromagnetic effects and complete post-layout extraction for ICs designed using Samsung’s 8nm RF process technology. The 8nm RFIC process is Samsung’s latest addition to an already broad portfolio of RF-related solutions.
Cadence is an industry-recognized leader in advanced-node RFIC design, layout, and verification. The Cadence® Virtuoso® RF Solution offers RF analyses built on silicon-proven simulation engines in both the time and frequency domains. Cadence products supported in the 8nm RF IC design reference flow include:
- Virtuoso ADE Product Suite
- Spectre® RF Simulator
- Quantus™ Extraction Solution
- Pegasus™ Physical Verification System
- EMX® Planar 3D solver
“At Samsung Foundry, we have worked hard to supply our customers with feature-rich, high-performance technology and design flows that are highly efficient,” said Sang-Yoon Kim, vice president of the Foundry Design Technology Team at Samsung Electronics. “The combination of our technology with the Cadence RFIC tool flow sets a new standard in low-power, high-performance RFIC design and can enable the delivery of high-quality RFICs to our many mutual customers.”
“Cadence is a longstanding innovator in advanced-node IC design and has been a key enabler of every evolution in process technology over the last decade,” said Tom Beckley, senior vice president and general manager in the Custom IC & PCB Group at Cadence. “This record of technology innovation and leadership continues in RFIC, where Cadence and Samsung have mutual customers looking for innovative IC design solutions that will help them design and deliver the next-generation of RFICs for 5G applications.”
Suggested Items
Boeing Opens Research & Technology Center in Japan
04/23/2024 | BoeingBoeing today opened a Boeing Research & Technology (BR&T) Center in Japan that will focus on innovation to enable the commercial aviation industry meet its goal of net zero carbon emissions by 2050.
Schweizer Electronic Appoints Thomas Gottwald as New Member of the Executive Board
04/23/2024 | Schweizer Electronic AGThe Supervisory Board of Schweizer Electronic AG has appointed Mr. Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of 3 years with effect from 1 May 2024.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
04/23/2024 | IntelThe U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
Real Time with... IPC APEX EXPO 2024: Industrial Quality Solutions from Zeiss
04/23/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Herminso Gomez of Zeiss Group discuss the company's industrial quality solutions, with a focus on X-ray technology. Zeiss provides a range of microscopy options and Herminso highlights the advantages of X-ray technology for aerospace, medical, and consumer electronics sectors.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.