Tektronix Partners with BRIDG to Boost Domestic Semiconductor Package Testing


Reading time ( words)

Tektronix Inc., a leading provider in test and measurement solutions, announced an official collaboration with BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and integrated circuit packaging. This collaboration will expand advanced semiconductor package testing capabilities in the US.

Whether in a hand-held consumer device or in the sophisticated electronics of an aircraft, at the heart of electronics reside integrated circuits (ICs). The bare semiconductors in these ICs are typically too small and delicate to be placed directly on electronic circuit boards.  So, IC packaging encapsulates the semiconductor into a device that is suitable for electronics manufacturing – often taking the form of the black squares seen soldered onto circuit boards.

As ICs become smaller, faster, and more complex, routing electronic signals through the packaging from the semiconductor to the outside world becomes notoriously difficult.  Packaging advancements must be made to support the requirements of multiple industries.  Tektronix is partnering with BRIDG to develop new techniques to test the latest state-of-the-art packaging.

"BRIDG is at the forefront of advanced packaging innovation, and we're thrilled to partner with them as their preferred test partner to drive critical advancements in the U.S. semiconductor industry," said Lindsay Ramirez, General Manager, Tektronix Component Solutions.

The partnership leverages Tektronix' state-of-the-art package test services and capabilities to provide semiconductor testing, advanced package testing, and 2.5D/3D testing for BRIDG customers. With a focus on the military and defense industry, Tektronix Component Solutions and BRIDG are U.S. Department of Defense, Defense Microelectronics Activity Category 1A trusted suppliers. This partnership will help strengthen domestic semiconductor supply chain, design, and manufacturing capabilities. Tektronix is expanding domestic packaging production by integrating innovative solutions driving advanced packaging technology such as 2.5D/3D architectures, which reduce size, weight, power, and cost versus traditional semiconductor packaging.

Earlier this year, President Biden signed into law the CHIPs and Science Act of 2022. The Act makes available $52.7 billion in funding in the disciplines of American semiconductor research, development, and production. The advanced system integration and integrated circuit packaging collaboration between Tektronix and BRIDG is one of the types of disciplines supported by the CHIPs and Science Act.

"New technologies require the most secure and cutting-edge testing solutions available," stated James Vandevere, BRIDG President. "With the expertise provided by Tektronix, we will strengthen our role as a vital hub coordinator enabling the ability to accelerate the adoption of package testing innovation to deploy technologies faster for our customers."

Share




Suggested Items

Lab Tests Armored Vehicles with Auto Industry 'Dummies'

07/25/2016 | U.S. Army
In an unassuming warehouse on Aberdeen Proving Ground, Maryland sit nearly 50 men in uniform, waiting for their mission during an upcoming test event. They're sporting Army Combat Uniforms, standard-issue boots, a crane hook protruding from their heads, and a plethora of color-coded wires spilling out the back of their necks.

FLA Program Takes Flight

02/15/2016 | DARPA
They may not have zoomed flawlessly around obstacles like the Millennium Falcon did as it careened through the hull of a crashed Star Destroyer in Star Wars VII. But the sensor-loaded quadcopters that recently got tested in a cluttered hangar in Massachusetts did manage to edge their way around obstacles and achieve their target speeds of 20 meters per second.

Mr. Laminate Tells All: Who Would Like a Mil-Spec Audit?

01/05/2016 | Doug Sober, Essex Technologies Group
I remember when IPC-4101 was completed and released in December 1997 and the question came up “should IPC create a policeman program to enforce it?” To a person that helped create IPC-4101, absolutely no one wanted such an audit program ever again. Including me and the IPC staff liaisons. Maybe we should have rethought that position.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.