CAES Design Win of RISC-V/NOEL-V IP for Idaho Scientific Secure Processor for US Critical Infrastructure

Reading time ( words)

CAES, a leader in advanced mission-critical electronics for aerospace and defense, announced that it has won its first commercial U.S.-based license for its RISC-V/NOEL-V processor IP with Idaho Scientific, based in Boise, Idaho.

Idaho Scientific specializes in solutions that prevent hardware and software security attacks. These solutions help protect high-reliability systems that support critical infrastructure.

“CAES is excited about this win for our newest generation CPU core. It is especially exciting to see a customer outside of our traditional target section, the Space industry, understanding the value of our IP to offer differentiation for their products and platforms,” said Mike Elias, Senior Vice President and General Manager, Space Systems Division, CAES. 

The announcement builds on a license agreement CAES signed with Idaho Scientific earlier this year for the NOEL-V IP for both FPGA and ASIC instantiations, which allows Idaho Scientific access to the IP’s source code.

Idaho Scientific will utilize the IP in its development of a secure processor that prevents memory corruption, which is a fundamental vulnerability of most commercial processors. This will enable a trusted and secure processing platform that can be utilized by a variety of vital assets.

Having access to the source code of the RISC-V/NOEL-V processor IP allows Idaho Scientific’s designers to build a unique ground up processor architecture which will include their own value-added functionality to maximize mitigation of tampering via cyberattacks.

“Idaho Scientific is proud to collaborate with CAES in developing this next-generation processing technology, which is instrumental to build intelligent, powerful and secure systems for critical infrastructure equipment,” said Dale Reese, President of Idaho Scientific.

“CAES’s RISC-V implementation, the NOEL-V IP, has several features that are critical in the implementation of our unique processing architecture,” said Dan Herway, Vice President of Idaho Scientific. “The fact that we can utilize both our previous work, and also take advantage of open source state-of-the-art software already available for the RISC-V, was a key factor in our selection of CAES IP.”


Suggested Items

A Challenge Facing Aerospace Designers In 2023

01/24/2023 | Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP

01/17/2023 | Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).

US, Japan Sign Space Collaboration Agreement at NASA Headquarters

01/16/2023 | NASA
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.