MKS’ Atotech to Participate at Semicon Korea 2023

Reading time ( words)

MKS’ Atotech will be exhibiting at Semicon Korea 2023. The show will be held at COEX, Seoul from February 1-3 and our team will be at booth C844 in hall C to inform about our ECD processes for advanced packaging and electroless processes for power semiconductors.

The fabrication of modern semiconductor devices requires different plating solutions for the different applications and structures. Atotech provides the complete plating offering for pillars, micro vias, fine line RDL (redistribution layer) and solder application which are required in advanced packaging. Additionally, we offer leading ENEPIG plating solutions for pad metallization for power applications.

Our show highlights include: Spherolyte® Cu UF 3 and Spherolyte® Cu DB / NT Cu.

Spherolyte® Cu UF 3 serves to deposit pure Cu for RDL and via filling in advanced packaging applications such as in fan-out wafer level packaging (FOWLP). Spherolyte® UF 3 enables high reliability with higher via filling performance, stable plating uniformity and higher copper purity compared to conventional Cu processes.

In addition, our R&D processes Spherolyte® Cu DB and Spherolyte® NT Cu are targeted towards next generation Cu-to-Cu hybrid bonding applications with low annealing temperatures. Spherolyte® Cu DB is one of our processes, allowing the deposition of metastable copper, while Spherolyte® NT Cu allows the deposition of copper nanotwins.

Event: Semicon Korea 2023
Date: February 1-3, 2023
Venue: COEX, Seoul
Booth: C844


Suggested Items

CES 2021 Coverage: A Virtual Show Floor

01/17/2021 | Dan Feinberg, Technology Editor, I-Connect007
I write this on the final day of CES 2021, and I expect CES will never be the same. It will not revert back to what it once was. I also cannot imagine it stays a totally virtual show; in doing so, I feel it would fail. Does that mean I think the 2021 show was a failure? No, not at all. In fact, it was a very good event, particularly in light of the medical and political pandemic that we have been enduring.

Liquid Cooling Moves Onto the Chip for Denser Electronics

10/05/2015 | Georgia Institute of Technology
Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it's needed the most - a few hundred microns away from where the transistors are operating.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.