MKS’ Atotech to Participate at Semicon Korea 2023
January 25, 2023 | MKS’ AtotechEstimated reading time: 1 minute
MKS’ Atotech will be exhibiting at Semicon Korea 2023. The show will be held at COEX, Seoul from February 1-3 and our team will be at booth C844 in hall C to inform about our ECD processes for advanced packaging and electroless processes for power semiconductors.
The fabrication of modern semiconductor devices requires different plating solutions for the different applications and structures. Atotech provides the complete plating offering for pillars, micro vias, fine line RDL (redistribution layer) and solder application which are required in advanced packaging. Additionally, we offer leading ENEPIG plating solutions for pad metallization for power applications.
Our show highlights include: Spherolyte® Cu UF 3 and Spherolyte® Cu DB / NT Cu.
Spherolyte® Cu UF 3 serves to deposit pure Cu for RDL and via filling in advanced packaging applications such as in fan-out wafer level packaging (FOWLP). Spherolyte® UF 3 enables high reliability with higher via filling performance, stable plating uniformity and higher copper purity compared to conventional Cu processes.
In addition, our R&D processes Spherolyte® Cu DB and Spherolyte® NT Cu are targeted towards next generation Cu-to-Cu hybrid bonding applications with low annealing temperatures. Spherolyte® Cu DB is one of our processes, allowing the deposition of metastable copper, while Spherolyte® NT Cu allows the deposition of copper nanotwins.
Event: Semicon Korea 2023
Date: February 1-3, 2023
Venue: COEX, Seoul
Booth: C844
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.