Qualcomm Unveils AI Powered Video Conferencing Solution for Accelerating Future of Work
February 2, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
Qualcomm Technologies, Inc. announced its latest intelligent video collaboration solution, the Qualcomm® QCS8250 Video Collaboration Reference Design, an all-in-one HW and SW platform natively supporting unified communications applications with on-device AI and superior camera and audio quality. The solution is designed to enhance virtual meetings and collaboration in today’s modern hybrid work environments.
The Qualcomm QCS8250 Video Collaboration Reference Design combines industry-leading technology in audio, video, and AI to deliver features that eliminate distractions, enhance productivity and allow virtual meeting participants to feel fully immersed, while in-person participants can easily engage with their on-screen colleagues.
This all-in-one reference design is targeted for medium to large conference rooms, and can natively run unified communications applications or operate in device mode for PC hosted meetings. The platform leverages the Qualcomm® AI Suite for Video Collaboration/Video Conferencing to offer customizable on-device AI capabilities that are specifically tailored to enhance the video conferencing experience including:
- AI Group Framing: Our video AI will automatically detect people in the conference room and smoothly zoom in or out using its three Ultra HD cameras (ultra-wide, wide and telephoto) to provide an optimal view of all the meeting participants.
- AI Speaker Framing: By combining Qualcomm Technologies’ audio capture with our video AI and virtually seamless switching between three 4K UltraHD cameras it can identify a person who is speaking and zoom in on that person to provide a close up, more detailed view of the presenter.
- AI Noise Suppression: State-of-the-art neural networks-based noise suppression technology isolates a speaker’s voice, and eliminates distracting, background noises such as food wrappers being opened, paper shuffling, pen clicking, or keyboard typing, without needing multiple microphones required by traditional solutions.
Additionally, the Qualcomm QCS8250 AI framework is designed in a modular fashion to facilitate third-party independent software vendors to easily enable support for other AI features.
“Today’s distributed workforce and evolving hybrid work and learning environments increasingly demand video collaboration solutions that will keep employees and colleagues productive and engaged,” said Dev Singh, vice president, business development, Qualcomm Technologies, Inc. “Qualcomm Technologies is continuing to push the boundaries of AI across audio, camera and video, and our latest Qualcomm QCS8250 reference design enables more immersive, virtually seamless video conferencing experiences that ensures all colleagues, whether in-person or remote, can be clearly seen and heard.”
Suggested Items
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.