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Teledyne FLIR Defense Awarded $249M IDIQ Contract for U.S. Marine Corps Organic Precision Fires-Light Program

04/15/2024 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has been awarded an Indefinite Delivery/Indefinite Quantity (IDIQ) contract worth up to $249 million by the U.S. Marine Corps Systems Command for its Organic Precision Fires-Light (OPF-L) program. The initial delivery order is valued at $12 million.

Material Insight: The Importance of Standards for the Chip Packaging Industry

04/12/2024 | Dr. Preeya Kuray -- Column: Material Insight
I had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across industry and academia to deliberate one of the most pressing technological matters of 2024: chip packaging standards.

Renesas Expands Quick Connect Studio

04/11/2024 | BUSINESS WIRE
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced new features and additional coverage for its Quick Connect Studio, a cloud-based embedded system design platform. Quick Connect Studio enables users to graphically co-optimize hardware and software to quickly validate prototypes and accelerate product development.

Mark Schulman Rocks Zuken Innovation World + integrate24

04/10/2024 | Zuken
Zuken USA, Inc. is excited to announce that the renowned drummer and motivational speaker, Mark Schulman, will be the keynote speaker at this year's Zuken Innovation World Americas (ZIW) conference, co-located with integrate24. Scheduled for September 17-19, 2024, in the vibrant city of Cleveland, Ohio, the conference aims to bring together the brightest minds in the PCB, Wire Harness, and Digital Engineering fields.

MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling

04/09/2024 | MKS Instruments, Inc.
MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials. 
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