High-Speed Intelligence in the Era of IoT
September 10, 2015 | BPAEstimated reading time: 1 minute
More and more people, organisations and functions are being connected with devices that in themselves are becoming increasingly intelligent.
Intelligence = Value as people realise the additional services and capabilities that sophistication brings. Facebook, as an example, started as an electronic photo album and has become a powerful and complex vector across social media.
Telecom is driving ahead. 4G, and 5G to follow, continue the Tsunami like sweep of data and communications across all aspects of our lives.
Unmanned smart communication is stepping into a new realm at the M2M level. The relatively simple signals from many of the 50Bn devices expected in the ‘Internet of Things’ will not add a dramatic communications load. But, what about the massive opportunity in data processing as we begin to realise the business opportunities resulting from the generation and capture of data generated through the IOT over the next five years?
The communications backbone continues to see significant increases in demand as data from the IOT will need to be stored, manipulated and communicated to realise its value and most importantly revenue streams.
It could be argued that we are going to move into the next generation of the internet. In this new manifestation, moving large files for video streaming, photos for social media and storage will remain and grow but in addition to this, many small pieces of data (Kilobytes rather than Megabytes or Gigabits’) will be gathered, particularly by commercial transactions. This will have the effect of shifting the load much deeper into the home or the enterprise. Can we use existing technologies; do we need fibre not only to the home or the enterprise but even fibre to the node?
This report is going to look at this new pyridine of big data and analyse how this will affect the Datacomms infrastructure and its impact on the technologies demanded. It will also analyse how systems will need to adapt (Routers, servers, base-stations etc) and how supporting technologies such as ICs, PCBs, Laminates and optical interconnect technology (where applicable) will be required to facilitate this next stage of the internet.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Real Time with... IPC APEX EXPO 2024: Industrial Quality Solutions from Zeiss
04/23/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Herminso Gomez of Zeiss Group discuss the company's industrial quality solutions, with a focus on X-ray technology. Zeiss provides a range of microscopy options and Herminso highlights the advantages of X-ray technology for aerospace, medical, and consumer electronics sectors.
Altair Acquires Cambridge Semantics, Powering Next-Generation Enterprise Data Fabrics and Generative AI
04/22/2024 | AltairAltair a global leader in computational intelligence, acquired Cambridge Semantics, a modern data fabric provider and creator of one of the industry’s leading analytical graph databases.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.