Enthone Publishes Semiconductor Wafer Level Packaging Guide

Reading time ( words)

Enthone has published a semiconductor wafer level packaging (WLP) guide. The guide describes how key growth drivers have resulted in making WLP chemistry a critical component in helping wafer foundries, OEMs, and IDMs address the ever-changing industry landscape.

The WLP guide provides an overview of how Enthone supports the integration between Front-end wafer fabrication and Back-end assembly processes and discusses:

  • WLP growth in demand, complexity, customization
  • The importance of chemistries optimized for specific design and tool capabilities
  • WLP Six Sigma Applications and R&D; advanced laboratories and manufacturing
  • MICROFAB® WLP Processes for copper bump/pillar/post, copper RDL, and TSV

Eric Gongora, Global Director, Enthone Semiconductor Product Marketing said, “By collaborating with leading equipment and materials suppliers, Enthone co-develops advanced chemistries demanded by today’s highly competitive semiconductor market. Our collaborative model accelerates time to market, while aligning with our customers’ technology roadmaps.”

To obtain a copy of the guide, please email electronics@enthone.com.

About Enthone

Enthone Inc., an Alent plc company, is an advanced technology company that provides high performance specialty chemicals and coatings that are specified and trusted by the world’s leading OEMs. A Six Sigma company, Enthone creates customer value for the electronics and automotive industries by delivering enabling technology solutions that meet ever-changing market dynamics and comply with current and emerging environmental regulations. Technical applications expertise, fast cycle R&D, and advanced manufacturing fuel a robust product portfolio that includes market-leading printed circuit board final finishes, wafer level packaging systems, connector / leadframe chemistries, molded interconnect device plating systems, and the industry’s leading semiconductor damascene copper processes. Enthone products are also used for a wide range of market applications within the building hardware, energy, and surface finishing industries. For more information, please visit enthone.com



Suggested Items

Liquid Cooling Moves Onto the Chip for Denser Electronics

10/05/2015 | Georgia Institute of Technology
Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it's needed the most - a few hundred microns away from where the transistors are operating.

Copyright © 2020 I-Connect007. All rights reserved.