FEATURED NEWS AND INFORMATION:

Latest News

Magnachip Introduces New Generation Low-Voltage MOSFET for Battery Protection Circuit Modules in Smartphones
01/14/2022 | PRNewswire
TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China
01/14/2022 | ACN Newswire
SEMI Issues Recommendations for European Commission to Bolster Europe’s Chip Ecosystem Resilience and Competitiveness
01/14/2022 | SEMI
Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems
01/13/2022 | Cadence Design Systems
Keysight Selected by Chunghwa Telecom to Accelerate Verification of ORAN Equipment
01/13/2022 | Keysight Technologies, Inc.
Global Fab Equipment Spending Projected to Log Record High in 2022
01/13/2022 | SEMI
Narda-MITEQ Acquires Intelligent RF Solutions
01/13/2022 | PRNewswire
Lacuna, Semtech Expand LoRaWAN Coverage Through IoT to Satellite Connectivity
01/12/2022 | Semtech
GRC Collaborates with Intel to Increase Data Center Sustainability
01/12/2022 | Business Wire
China’s Share of Global Chip Sales Now Surpasses Taiwan’s, Closing in on Europe’s and Japan’s
01/12/2022 | SIA
FEATURED ARTICLES AND COLUMNS:

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 3

November 1, 2021 | Brad Griffin, Cadence Design Systems

The third chapter of this book, "Limitations of Today's Electronic System Design", focuses on the variety of limitations that today’s electronics system designers face as data becomes evermore complex and the industry seeks alternatives past Moore’s law.

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 2

October 7, 2021 | Brad Griffin, Cadence Design Systems

In Chapter 2 of this book, the subject involves the challenges in the design and development of data center systems. With the exponential growth in data center infrastructure for IT networking, numerous challenges have emerged, from limited ecosystems to high-performance computing issues. There are many constraints to building data centers and updating the equipment in them. Planning is critical in managing increased capacity in the existing data center space.

Averatek Pushing Boundaries of Additive and Semi-Additive Processes

July 12, 2021 | Andy Shaughnessy, Design007 Magazine

At the IEEE International Microwave Symposium show in Atlanta, I met with Tara Dunn, I-Connect007 columnist and VP of marketing and business development for Averatek. We sat down at the show and discussed the past year and a half, and after joking about how we felt like we were on an episode of The Twilight Zone, Tara gave me an update on Averatek’s continuing research into additive and semi-additive technologies.

More news...


Cybersecurity and Counterfeiting Featuring:

  • Making the Most of a Smart Factory Initiative interview with Joel Scutchfield 

  • Every Cloud Has a Silver Lining by Dan Beaulieau 
 

  • ‘Trust Me–I Have Your Chips Right Here!’ by Michael Ford 

  • The Under-reported Story of the Semiconductor Shortage: Counterfeits by Bill Cardoso 

  • Don’t Hit the Snooze on Cybersecurity by Divyash Patel 

  • The Impact of Obsolescence and Shortages on Counterfeit Risk by Vernon Densler 

  • Counterfeit Mitigation by In-line Deep Visual Inspection by Eyal Weiss 

  • Component Level Traceability in a Counterfeit World by David Mills 


IPC APEX EXPO Preview Issue Featuring:

  • Industry Market Drivers, Inflation, and the Supply Chain, with Shawn DuBravac 
  • Sarah Czaplewski Discusses the PCB Fabrication and Materials Track 
  • Steve Williams Explains ‘AS9100D: 2016 in Plain English’ 
  • John Mitchell: Focus on the Future
  • IPC STEM Event a Real Motivator for High School Students, with Harold Mumford 
  • STEM Program on the Grow, with Charlene Gunter du Plessis
  • Meet Drew, a Student With an Interest in STEM by Barry Matties
  • What to Expect Regarding COVID Restrictions, by Alicia Balonek 
  • Fabricator and Supplier Exhibitor Survey Responses, by PCB007 Staff 

 

High-Voltage PCB Design  Featuring:

High-Voltage PCB Design: Beating Separation Anxiety, a conversation with Andy Buja, Wilmer Companioni and Sanu Warrier  

High-Voltage Circuit Design Guidelines and Materials, by Celso Faia and Davi Correia 

High-Voltage PCB Constraints, by Barry Olney 

Automotive Electrification, by Michael Gay 

The Misadventures of High Voltage and Other Power Problems, by Tim Haag 

A High-Voltage PCB Design Primer, by Zachariah Peterson 

Uncompensated DC Drop in Power Distribution Networks, by Istvan Novak

Copyright © 2022 I-Connect007. All rights reserved.