FEATURED NEWS AND INFORMATION:

Latest News

Peplink Sees Large Growth in 5G Demand as Partnership with M2M Connectivity Expands
New Today | GlobeNewswire
A*STAR, STMicroelectronics Team Up on Silicon Carbide R&D for EV Market, Industrial Applications
New Today | GlobeNewswire
Micron, UMC Announce Global Settlement
New Today | Micron
Ultrathin Solar Cells Get a Boost
New Today | Rice University
Intel Teams with Snowflake
New Today | Intel
NexOptic Optimizating on Qualcomm Technologies’ Snapdragon Mobile Platforms
11/25/2021 | GlobeNewswire
Intel Powers New Amazon EC2 Instance
11/25/2021 | Intel
Mavenir Announces Commercial Availability of 4G Open RAN-based Outdoor Small Cell
11/25/2021 | Business Wire
Ansys Receives 2021 TSMC OIP Partner of the Year Awards for Next-Generation Design Enablement
11/24/2021 | ANSYS
Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas
11/24/2021 | Samsung
FEATURED ARTICLES AND COLUMNS:

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 3

November 1, 2021 | Brad Griffin, Cadence Design Systems

The third chapter of this book, "Limitations of Today's Electronic System Design", focuses on the variety of limitations that today’s electronics system designers face as data becomes evermore complex and the industry seeks alternatives past Moore’s law.

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 2

October 7, 2021 | Brad Griffin, Cadence Design Systems

In Chapter 2 of this book, the subject involves the challenges in the design and development of data center systems. With the exponential growth in data center infrastructure for IT networking, numerous challenges have emerged, from limited ecosystems to high-performance computing issues. There are many constraints to building data centers and updating the equipment in them. Planning is critical in managing increased capacity in the existing data center space.

Averatek Pushing Boundaries of Additive and Semi-Additive Processes

July 12, 2021 | Andy Shaughnessy, Design007 Magazine

At the IEEE International Microwave Symposium show in Atlanta, I met with Tara Dunn, I-Connect007 columnist and VP of marketing and business development for Averatek. We sat down at the show and discussed the past year and a half, and after joking about how we felt like we were on an episode of The Twilight Zone, Tara gave me an update on Averatek’s continuing research into additive and semi-additive technologies.

More news...


Test and Inspection Featuring:

  • Test Strategies and Pain Points with Bert Horner
  • Where AI Meets Test and Inspection with Yan Manissadjian, Alexia Vey, and Jesse Dowd
  • Market Changes Require Re-evaluating Your Testing Processes with Bob Neves
  • Research and Development Leads to Biogreen Coatings with Phil Kinner
  • Conformal Coatings and Legacy X-rays with Ed Moll
  • Keysight’s Massively Parallel Board Test with Christopher Cain

Test and Inspection Featuring:

  • Test and Inspection: Far Beyond Opens and Shorts, with Todd Kolmodin 
  • Fascinating Opportunities in Flying Probe Testing, with Peter Brandt 
  • New Methods for Quantifying Potential PCB Design Weaknesses and Manufacturing Challenges, with Gerry Partida 
  • Test and Inspection: Competitive Advantage and Cost of Doing Business, with Charlie Capers 
  • Alex Stepinski: A Philosophical View
  • The New Electrical Test—Riding the Wave, by Todd Kolmodin

Herding Cats Featuring:

  • Data Management: It’s A Lot Like Herding Cats, by Andy Shaughnessy 
  • A PCB Design Data Management Overview, a conversation with John Watson, Dugan Karnazes, and Patryk Akhurst 
  • Manage Your Data and Document Everything, by Tamara Jovanovic 
  • Say 'No' to File Hoarding: Data Management Tips, by Tim Haag 
  • Solid Data Management Key to Accurate Quotes, by David Gronner  
  • IP Reuse Enables a Digital Transformation, by David Wiens 
  • Cost of Compliance and How Data Transfer Standards Can Help, by Patrick Crawford
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