FEATURED NEWS AND INFORMATION:

Latest News

Skyworks Completes Acquisition of the Infrastructure & Automotive Business of Silicon Labs
New Today | Business Wire
Intel Accelerates Process, Packaging Innovations
New Today | Intel
North American Semiconductor Equipment Industry Posts June 2021 Billings
New Today | SEMI
Electrolube’s UR5118 Resin Ticks All the Boxes for IoT RF Sensor Application
New Today | Electrolube
Qualcomm Completes World’s First 5G mmWave Data Connection with Support for 200 MHz Carrier Bandwidth
07/26/2021 | Qualcomm Technologies, Inc.
How the Lights-Out Setting is Redefining Manufacturing
07/26/2021 | PRNewswire
Samsung Expands Its Lineup of SDN Solutions
07/23/2021 | Samsung
Coalition Calls on Congress to Invest in Domestic Semiconductor Manufacturing, Research, Design
07/23/2021 | SIA
Inseego Unveils the Ultimate 5G Industrial Gateway
07/23/2021 | Business Wire
STMicroelectronics Joins Startup Autobahn as Anchor Partner to Meet Tomorrow’s Automotive Innovators
07/23/2021 | Globe Newswire
FEATURED ARTICLES AND COLUMNS:

Averatek Pushing Boundaries of Additive and Semi-Additive Processes

July 12, 2021 | Andy Shaughnessy, Design007 Magazine

At the IEEE International Microwave Symposium show in Atlanta, I met with Tara Dunn, I-Connect007 columnist and VP of marketing and business development for Averatek. We sat down at the show and discussed the past year and a half, and after joking about how we felt like we were on an episode of The Twilight Zone, Tara gave me an update on Averatek’s continuing research into additive and semi-additive technologies.

The Top Five Reasons Products Fail EMI Testing

May 12, 2021 | Kenneth Wyatt, Wyatt Technical Services

The three top product failures that Ken Wyatt sees constantly in his consulting practice are radiated emissions, radiated susceptibility, and electrostatic discharge. After reviewing and testing hundreds of products over the years, he's come to the conclusion that products fail these tests for five common reasons. Read on!

Exciting Advances From NVIDIA’s GPU

May 3, 2021 | Dan Feinberg, I-Connect007

NVIDIA’s Graphics Processing Technology Conference was, as expected, a showcase of new developments, as well as an opportunity for engineers and developers to learn, enhance skills, and discuss new ideas. Just hearing about all the amazing new developments and the accelerating expansion of AI in virtually all aspects of modern society gives those who attended a better idea of just how much AI is and will continue to change their work and our world.

More news...


Reliability Featuring:

  • Cleanliness Behind Many Assembly Challenges Interview with Eric Camden
  • The Meaning of (PCB) Life by Bob Neves
  • Ductility is Your Greatest 'Alloy'—Avoiding Drop Shock by Ranjit Pandher
  • How to Troubleshoot Your Testing Processes by Graham Naisbitt
  • IPC-WP-019: The How to Behind the Cleanliness Requirements in IPC J-STD-001G by Debora Obitz

Inflation—Supply and Demand Featuring:

  • Riding the Wave of Copper Inflation Pricing Interview with Mark Goodwin
  • Feeling The Supply Chain Squeeze Interview with Joe D’Ambrisi
  • The Demand for Copper Interview with Michael Coll and Chris Stevens
  • Economic Drivers Takes Us ‘Up, Up, and Away!’ by Shawn DuBravac
  • Working Through Shortages by Anaya Vardya
  • Navigating Current Market Dynamics Interview with Mark McMeen
  • Isola Responding to the Market Interview with Travis Kelly

Ask the Experts Featuring:

  • Ask the Design Experts, by Andy Shaughnessy
  • Meet the Experts
  • Ask the Experts: 16 of Your Burning Questions... Answered
  • Ask the Experts—PDN Filters, by Istvan Novak
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