FEATURED NEWS AND INFORMATION:

Latest News

Electronic Nose Distinguishes Mint Scents
05/07/2021 | KIT
IBM Unveils World's First 2 Nanometer Chip Technology, Opening a New Frontier for Semiconductors
05/07/2021 | IBM
Researchers Develop New Graphene-based Sensor Technology for Wearable Medical Devices
05/07/2021 | Trinity College Dublin
Smaller, More Powerful, Unrivaled
05/07/2021 | Fraunhofer-Gesellschaft
GENERA, Henkel Collaborate to Further Drive End-use Production in Additive Manufacturing
05/07/2021 | Henkel
Showa Denko, Infineon Technologies Conclude Supply Contract, Development Agreement
05/07/2021 | ACN Newswire
PsiQuantum, GLOBALFOUNDRIES to Build World’s First Full-scale Quantum Computer
05/06/2021 | Business Wire
AIStorm’s AI-in-Imager Solutions Use Tower Semiconductor’s Hi-K VIA Capacitor Memory
05/06/2021 | Business Wire
Samsung Electronics: Next Generation 2.5D Integration Solution ‘I-Cube4’ Available
05/06/2021 | Business Wire
Qorvo Acquires Leading MEMS-based Sensor Solution Provider NextInput
05/06/2021 | Globe Newswire
FEATURED ARTICLES AND COLUMNS:

Exciting Advances From NVIDIA’s GPU

May 3, 2021 | Dan Feinberg, I-Connect007

NVIDIA’s Graphics Processing Technology Conference was, as expected, a showcase of new developments, as well as an opportunity for engineers and developers to learn, enhance skills, and discuss new ideas. Just hearing about all the amazing new developments and the accelerating expansion of AI in virtually all aspects of modern society gives those who attended a better idea of just how much AI is and will continue to change their work and our world.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

April 30, 2021 | Nolan Johnson, I-Connect007

This week’s biggest news came in the form of industry briefings—there were a lot of them and the news was universally positive. The news you need to read for this week includes three reports from IPC detailing: the strength and risks in the global economic recovery; a strong EMS book-to-bill ratio; and strong North American PCB sales. Zeroing in on a single company, Apple reported a significant jump in revenue.

Benchmarking Your Process Engineering

April 29, 2021 | I-Connect007 Editorial Team

Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

More news...


IPC Committees Featuring:

  • The Structure Behind IPC Committees Interview with Teresa Rowe
  • IPC: Driving Our Industry for 64 Years by Dan Feinberg
  • An Inside Look at the IPC Committee Process Interview with IPC directors and program managers
  • IPC Technical Staff Liaisons—Your ‘Shepherds’ in the IPC Standards Development Process by John Perry
  • Why You Should Get Involved in IPC Standards by Chris Jorgensen
  • A Tribute to Dieter Bergman by David Bergman
  • Get Involved with IPC’s EHS-Related Committees by Kelly Scanlon

Focus on Manufacturing Featuring:

  • Benchmarking Your Process Engineering Interview with Mark Thompson
  • Driving Down Cost With Process Engineering Interview with Matt Mack
  • Reinvigorate Your Manufacturing Infrastructure by Mark Goodwin
  • Selling for the Best by Dan Beaulieu
  • Benchmarking for Yield Improvement and Scrap Reduction by Todd Johnson

Top Design Challenges Featuring:

  • PCB Design Challenges: Designing With DDR, Interview with Rick Hartley and Barry Olney
  • The Top Five Reasons Products Fail EMI Testing, by Ken Wyatt
  • Planning and Communication: Keys to Optimizing Your Design Time, by Chris Young
  • My Ongoing Journey Toward DFM, by Kelly Dack
  • My Top Six Design Challenges, by Mark Thompson
  • Meeting the Challenge With Design Reuse, by Stephen V. Chavez
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