Stellantis, Foxconn Partner to Design, Sell New Flexible Semiconductors for Automotive Industry
December 7, 2021 | FoxconnEstimated reading time: 1 minute
Stellantis N.V. and Hon Hai Technology Group, (Foxconn) announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers.
“Our software-defined transformation will be powered by great partners across industries and expertise,” said Carlos Tavares, Stellantis CEO. “With Foxconn, we aim to create four new families of chips that will cover over 80% of our semiconductor needs, helping to significantly modernize our components, reduce complexity, and simplify the supply chain. This will also boost our ability to innovate faster and build products and services at a rapid pace.”
This partnership was announced as part of the Stellantis Software Day 2021 event where the Company unveiled STLA Brain, the new electrical/electronic and software architecture launching in 2024 across Stellantis’ four battery electric vehicle-centric platforms – STLA Small, Medium, Large and Frame. STLA Brain is fully OTA capable, making it highly flexible and efficient.
“As a leading global technology company, Foxconn has the depth of experience in manufacturing semiconductors and software - two key components in the production of electric vehicles. We look forward to sharing this expertise with Stellantis and together tackle the long-term supply chain shortages, as we continue with the expansion into the electric vehicle market,” said Young Liu, Chairman & CEO of Foxconn Technology Group.
The collaboration will support Stellantis’ initiatives to reduce semiconductor complexity, design an all-new family of purpose-built semiconductors to support Stellantis vehicles, and provide capabilities and flexibility in this area of growing importance as vehicles become increasingly software-defined.
The partnership will leverage Foxconn’s domain know-how, development capabilities, and supply chain in the semiconductor industry, as well as Stellantis’ expansive automotive expertise and significant scale as a lead customer for the enterprise.
Foxconn has a long-running history of developing semiconductors and applications within consumer electronics, which will expand to the automotive space with the guidance and demand of a world-class mobility partner. These same semiconductors will be utilized within the Foxconn EV ecosystem as Foxconn continues to extend its capabilities in electric vehicle manufacturing.
The announcement marks the second collaboration between Stellantis and Foxconn. In May, the companies announced the Mobile Drive joint venture aimed at developing smart cockpit solutions enabled by advanced consumer electronics, HMI interfaces and services that will exceed customer expectations.
Suggested Items
Avnet Launches QCS6490 Vision-AI Development Kit
05/17/2024 | AvnetThe QCS6490 Vision-AI Development Kit from Avnet enables engineering teams to rapidly prototype hardware, application software and AI enablement for multi-camera, high-performance, Edge AI-enabled custom embedded products.
Altus Adds PVA's Game Changing PathMaster X Software to Portfolio
05/16/2024 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has announced the addition of PVA's new PathMaster X software to its product portfolio. PathMaster X transforms programming for PVA's conformal coating and dispensing systems with an intuitive, game-like controller interface.
Saki Set to Highlight Cutting-Edge Inspection Technology at SMTConnect 2024
05/15/2024 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at SMTConnect 2024 in Nuremberg, Germany from June 11-13. As a key highlight of the Selecs booth #235 in Hall 4, Saki will be showcasing its unique range of automated inspection solutions including the award-winning X-ray Automated Inspection System (AXI) and innovative ‘One Programming’ and AI Solutions Features.
Siemens Partners with Microsoft to Deliver AI-enhanced Solutions for Resilient Product Lifecycle Management with Azure
05/14/2024 | PRNewswireSiemens Digital Industries Software announced an expansion of its partnership with Microsoft to make the Siemens Xcelerator as a Service portfolio of industry software available through Microsoft's cloud and AI platform Azure and integrating it with generative AI and Copilot features.
Real Time with… IPC APEX EXPO 2024: Modernizing a PCB Facility
05/13/2024 | Real Time with...IPC APEX EXPOAidan Salvi, chief transformation officer at Amitron, discusses modernizing the company's PCB facility including equipment selection, installation, process redefinition, staff upskilling, university engagement, and customer relationship building. Emphasizing that this is a significant endeavor not to be undertaken lightly, Aidan highlights the importance of focus, software technology use, and a step-by-step approach to modernization. He recommends caution when assessing whether to approach factory modernization as one big project or take a more measured approach to modernize in segments.