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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

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Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.

EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS

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Real Time with… IPC APEX EXPO 2024: Transitioning Into Automation With DIS

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Publisher Barry Matties and DIS Sales Director Jesse Ziomek discuss the company's shift toward automation, tackling issues such as limited floor space and integration costs while showcasing the advantages their SAM automation system has to offer. Also discussed are workforce challenges and return on investment considerations. As Jesse states, "DIS's goal is to offer solutions for smaller shops," and underscores the user-friendly, no-integration-costs aspect of their system.

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Siemens Delivers New Solido IP Validation Suite

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Siemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
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