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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 9, 2023 | Andy ShaughnessyEstimated reading time: 2 minutes
It’s summertime, but the industry is staying pretty busy. This week, we have news about our industry putting pressure on our elected officials to provide funding for U.S. companies under the CHIPS Act, and a counterfeit parts symposium presented by SMTA in Maryland next month. We also bring you articles about ultra HDI design and material selection, and our most recent On the Line with… podcast with Zac Elliott of Siemens.
Next week, it looks like San Diego is the place to be as the International Microwave Symposium kicks off June 11 at the San Diego Convention Center. Our own Barry Matties and Nolan Johnson will be at the show all week, and our good friends Ventec, American Standard Circuits, Rogers and more will be exhibiting there. Don’t miss out.
Electronics Industry Leaders Call on Congress to Support $100M in PCB Sector Funding
Published June 6
Sure, the CHIPS Act is a step in the right direction, but we as an industry have to hold Congress’s feet to the fire. This letter from executives from 26 electronics manufacturers across the U.S. is a step in the right direction. It’s an election year, so our senators and representatives might be more amenable to our ideas than during an off year.
NASA to Keynote the Symposium on Counterfeit Parts & Materials
Published June 6
Counterfeit parts are a continuing problem in our industry. SMTA is hosting the Counterfeit Parts & Materials Symposium June 27–29 near my hometown in Hyattsville, Maryland, and NASA’s Dr. Peter Majewicz is presenting the keynote. If you’re in the defense sector, this is right in your wheelhouse.
Sustainability in Logistics Discussion Continues
Published June 7
This week, we dropped a new “pod,” as the kids say, continuing our conversation with Siemens Technical Marketing Engineer Zac Elliott. In this installment, Zac explains how logistics, done improperly, can create waste downstream in a variety of ways. Managing Editor Nolan Johnson has proven to be the breakout podcast star.
A Focus on Ultra HDI
Published June 5
John Johnson just joined American Standard Circuits, and he’s bringing along his expertise in ultra HDI. In this interview with Barry Matties, he shares his thoughts on these tiny traces and his plans for moving ASC forward in the ultra HDI realm.
Slash Sheets: Don’t Fall Into the Trap
Published June 8
When you’re selecting materials for a design, what documents do you consult? In this article from Geoffrey Hazelett, he explains why designers shouldn’t use IPC slash sheets in their material selection process, and he offers his thoughts on the best way to find the right laminate for your job.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, alongside reports from SEMI, USPAE, and EIPC, we simply had to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.