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TTM’s High Tech Expansion and Industry Innovation

04/30/2024 | Marcy LaRont, PCB007 Magazine
Tom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

American Made Advocacy: Going Beyond the CHIPS Act to Power American Manufacturing

03/26/2024 | Travis Kelly -- Column: American Made Advocacy
Where have all the factories gone? A tour of America’s former bustling manufacturing communities is a stark reminder that, for the past three decades, we let the microelectronics manufacturing ecosystem disappear overseas, primarily to Asia. For decades, foreign competitors seeking to control critical markets played a long game. Government investment and subsidies were effective in undercutting U.S. and European companies. As other countries created this unfair competitive advantage in manufacturing, the know-how also migrated in their direction. This resulted in the serious workforce challenges the semiconductor and printed circuit board industries face today.

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

03/18/2024 | IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry. 

CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

03/05/2024 | Renesas
The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India.
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