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NextFlex Convenes the Hybrid Electronics Community at Binghamton University

05/01/2024 | NextFlex
Binghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking. 

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference

04/30/2024 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.

New Appointment Strengthens Ventec’s Value-Added Equipment Division

04/29/2024 | Ventec
Ventec announces the appointment of Leigh Allinson as Commercial Director for its value-added PCB Equipment division 'Ventec Giga Solutions'.

Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program

04/25/2024 | Stanton Rak, SF Rak Company
As a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.

What’s Next Becomes Now at IPC APEX EXPO 2024

04/22/2024 | IPC
From revolutionary advancements in artificial intelligence, augmented reality and the latest innovations in capital equipment on the show floor to a heightened learner experience through the 16th Electronic Circuits World Convention (ECWC16) technical conference, IPC APEX EXPO 2024 provided education, professional development and numerous networking opportunities, for 3,723 attendees from 57 countries.
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