Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
The Pulse: Drilling Down on DocumentationHentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
April 17, 2024 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality. This technical paper encompasses critically important information and is entitled “An Essential Guide to Optimize Selective Soldering Processing.”
Topics covered within this publication include flux selection, flux application, thermal processing, no-clean thermal processing, flux residue mitigation, solder nozzle design, system flexibility, gold embrittlement, gold removal, and solderability testing.
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