New Chips Ease Operations In Electromagnetic Environs
January 12, 2016 | DARPAEstimated reading time: 2 minutes
Competition for scarce electromagnetic (EM) spectrum is increasing, driven by a growing military and civilian demand for connected devices. As the spectrum becomes more congested, the Department of Defense (DoD) will need better tools for managing the EM environment and for avoiding interference from competing signals. One recent DARPA-funded advance, an exceptionally high-speed analog-to-digital converter (ADC), represents a major step forward. The ADC could help ensure the uninterrupted operation of spectrum-dependent military capabilities, including communications and radar, in contested EM environments. The advance was enabled by 32 nm silicon-on-insulator (SOI) semiconductor technologies available through DARPA’s ongoing partnership with GlobalFoundries, a manufacturer of highly-advanced semiconductor chips.
The EM spectrum, whose component energy waves include trillionth-of-a-meter-wavelength gamma rays to multi-kilometer-wavelength radio waves, is an inherently physical phenomenon. ADCs convert physical data—that is, analog data—on the spectrum into numbers that a digital computer can analyze and manipulate, an important capability for understanding and adapting to dynamic EM environments.
Today’s ADCs, however, only process data within a limited portion of the spectrum at a given time. As a result, they can temporarily overlook critical information about radar, jamming, communications, and other potentially problematic EM signals. DARPA’s Arrays at Commercial Timescales (ACT) program addressed this challenge by supporting the development of an ADC with a processing speed nearly ten times that of commercially available, state-of-the-art alternatives. By leveraging this increased speed, the resulting ADC can analyze data from across a much wider spectrum range, allowing DoD systems to better operate in congested spectrum bands and to more rapidly react to spectrum-based threats.
How fast is fast? The new ADC samples and digitizes spectrum signals at a rate of over 60 billion times per second (60 GigaSamples/sec). That’s fast enough to directly detect and analyze any signal at 30 GHz or below—a range that encompasses the vast majority of operating frequencies of interest. Whereas scanning through these frequencies today requires costly application-specific hardware with long development cycles, the new ADC can provide a “one-stop shop” for processing radar, communications and electronic warfare signals.
Page 1 of 2
Suggested Items
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.